EMLC 2018 Conference attendees have the possibility of taking part in a
Tutorial at the MINATEC Conference Center on Monday, June 18th 2018,
14:00 to 17:00
EMLC 2018 - Tutorial
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14:00 |
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Welcome Uwe Behringer, UBC Microelectronics, EMLC 2018 Conference Chair
Introduction of the first Tutorial Speaker Izak Kapilevic, Applied Materials, USA |
14:05 - 15:20 |
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Inspection Challenges in the EUV Area Aviram Tam, Applied Materials PDC, Israel
This Tutorial will cover the use cases for blank inspection, pattern inspection, outgoing inspection, and the possible solution for DUV mask inspection, eBeam MI, Actinic blank inspection, on-wafer qualification, and how those evolve in each of the different scenarios for pellicle (no pellicle / detachable / 13.5nm only / 193nm friendly). |
15:20 - 15:40 |
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Coffee Break |
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15:40 - 15:45 |
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Introduction of the second Tutorial Speaker Jo Finders, ASML Netherlands B.V., Veldhoven, The Netherlands |
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15:45 - 17:00 |
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Review of OPC/ RET/ SMO Paul van Adrichem, ASML Netherlands B.V., Veldhoven, The Netherlands
This tutorial will provide an overview of advanced Optical Proximity Correction, Resolution Enhancement Technology as well as Source-Mask-Optimization. |
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17:00 |
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Get-Together and First Poster Session Uwe Behringer, Chair of EMLC2018, welcomes the participants and invites them to join the Get-Together concurrently with the first Poster Session. |
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17:05 - 18:00 |
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First Part of Poster Presentations Chair: Uwe Behringer, UBC Microelectronics, Ammerbuch, Germany Co-Chair: Rolf Seltmann, GLOBALFOUNDRIES, Dresden, Germany |