Please download the final programme here
10:30 |
Opening |
10:50 |
Session 1: Power Electronic Systems |
12:00 |
Lunch Break |
13:20 |
Session 2: System Integration |
15:10 |
Coffee Break |
15:40 |
Session 3: Reliability |
18:10 |
Break |
18:20 |
Session 4: Drivers |
19:20 |
Break |
19:30 |
Session 5: Dialog Session & Frankonian Snacks and Beverages |
08:30 |
Session 6: Power Electronics Applications |
10:00 |
Coffee Break |
10:30 |
Session 7: Power Modules |
12:30 |
Lunch Break |
13:50 |
Session 8: Power Electronics |
Session 10: Packaging |
15:30 |
Coffee Break |
16:00 |
Session 9: DC/DC |
Session 11: Materials |
17:20 |
Break |
17:30 |
Panel CAD Tools |
18:50 |
End |
20:00 |
Conference Dinner |
08:30 |
Session 12: Prognostics - Thermal Management |
10:20 |
Coffee Break |
10:40 |
Session 13: EMI & Cooling |
12:20 |
Lunch Break |
13:40 |
Session 14: Future Perspectives |
15:20 |
Closing |
15:40 |
End of the Conference |
Tuesday, March 16, 2010
10:30 Opening
Session 1: Power Electronic Systems
Chairmen: J. D. van Wyk, University of Johannesburg, South Africa; E. Wolfgang, ECPE e.V., Germany
10:50 Keynote: Performance, Trends and Limitations of Power Electronics Systems
J. W. Kolar, ETH Zurich, Switzerland
11:30 Integrated Gate Driver Solutions (Invited paper)
R. Herzer, Semikron Elektronik GmbH & Co. KG, Nuremberg, Germany
12:00 Lunch Break
Session 2: System Integration
Chairmen: B. Allard, Ampere-Lab, Villeurbanne, France; H. Ohashi, AIST, Ibaraki, Japan
13:20 High Density System Integration for Medium Power Applications (Invited paper)
D. Boroyevich, Z. Chen, F. Luo, K. Ngo, P. Ning, R. Wang, Di Zhang, Center for Power Electronics Systems, Virginia Tech, Blacksburg; F. Wang, University of Tennessee, Knoxville; R. Burgos, ABB U.S. Corporate Research Center, Raleigh; R. Lai, GE Global Research Center, Niskayuna; , S. Wang, GE Aviation Systems, Vandalia, United States
13:50 A Formal Approach to System Integration
J. M. Gutierrez-Alcaraz, S. W. H. de Haan, J. A. Ferreira, Delft University of Technology, The Netherlands
14:10 Design for Fault Tolerance and Predictive Failures
J. Wolmarans, J. A. Ferreira, H. Polinder, I. Josifovic, Delft University of Technology; D. Clarenbach, Aeronamic BV, Almelo, The Netherlands
14:30 Modular Concept for Power Electronics in Electric Cars
W. Wondrak, A. Dehbi, A. Willikens, Daimler AG, Boeblingen, Germany
14:50 Power Module with Solid State Circuit Breakers for Fault-Tolerant Applications
K. Kriegel, A. Melkonyan, M. Galek, Siemens Corporate Technology, Munich; J. Rackles, Munich University of Applied Sciences, Munich, Germany
15:10 Coffee Break
Session 3: Reliability
Chairmen: G. Coquery, INRETS, Versailles, France; U. Scheuermann, Semikron Elektronik GmbH & Co. KG, Nuremberg, Germany
15:40 Railway Traction Reliability (Invited paper)
M. Mermet-Guyennet, M. Piton, ALSTOM Transport, Semeac, France
16:10 First Power Cycling Results of Impoved Packaging Technologies for Hybrid Electrical Vehicle Applications
A. Hensler, J. Lutz, Chemnitz University of Technology; M. Thoben, K. Guth, Infineon Technologies AG, Warstein, Germany
16:30 How Materials Behaviour Affects Power Electronics Reliability
M. H. Poech, Fraunhofer Institute ISIT, Itzehoe, Germany
16:50 Interface Degradation of Al Heavy Wire Bonds on Power Semiconductors during Active Power Cycling Measured by the Shear Test
J. Goehre, M. Schneider-Ramelow, K.-D. Lang, Fraunhofer Institute IZM, Berlin; U. Geißler, Berlin University of Technology, Germany
17:10 Observation of Chip Solder Degradation by Electrical Measurements during Power Cycling
S. Hartmann, M. Bayer, D. Schneider, L. Feller, ABB Switzerland Ltd., Semiconductors, Lenzburg, Switzerland
17:30 A Novel Built-In Methodology for Screening LDMOS Transistors to Achieve Zero Defects in the Automotive Environment
V. Malandruccolo, M. Ciappa, W. Fichtner, Swiss Federal Institute of Technology (ETH), Zurich, Switzerland; H. Rothleitner, Infineon Technologies AG, Villach, Austria
17:50 The Future of Wire Bonding is? Wire Bonding!
D. Siepe, R. Bayerer, R. Roth, Infineon Technologies Austria AG, Villach, Austria
18:10 Break
Session 4: Drivers
Chairmen: N. Kaminski, University of Bremen; R. Bayerer, Infineon Technologies AG, Warstein, Germany
18:20 SiC BJT Driver Applied to a 2 kW Inverter: Performances and Limitations
D. Tournier, P. Bevilacqua, P. Brosselard, D. Planson, B. Allard, Université de Lyon, Ampere-Lab, Villeurbanne, France
18:40 Normally-On SiC JFETs in Power Converters: Gate Driver and Safe Operation
D. Bergogne, D. Risaletto, F. Dubois, A. Hammoud, H. Morel, P. Bevilacqua, B. Allard, Ampere-Lab, Villeurbanne; R. Meuret, S. Dhokkar, Hispano-Suiza SAFRAN group, Moissy Cramaye; O. Berry, S. Raël, F. Meibody Tabar, GREEN ENSEM 2, Vandoeuvre les Nancy, France
18:40 Insulating IGBT Driver with PCB Integrated Capacitive Coupling Elements
S. Zeltner, Fraunhofer Institute IISB, Erlangen, Germany
19:20 Break
19:30 Frankonian snacks and beverages will be served
Session 5: Dialog Session – Poster
Chairmen: M. Stoisiek, University of Erlangen, Germany; G. Busatto, University of Cassino, Italy; I. Omura, Kyushu Institute Technology, Japan; G. M. Martin, Valeo Créteil, France
P 01 MOS-Gated GTO: A New Functionally Integrated Device Suitable for High Voltage Power Applications
C. Ronsisvalle, V. Enea, ST Microelectronics, Catania; C. Abbate, G. Busatto, A. Sanseverino, University of Cassino, Italy
P 02 Importance of Boundary Conditions for Optimizing the Thermal Dimensioning of PCB Traces
L. Coppola, B. Agostini, R. Schmidt, R. Faria Barcelos, ABB Switzerland Ltd., Baden, Switzerland
P 03 Integrable Semiconductor Current Balancer for Paralleled Fluorescent Lamps
R. Weger, NMB-Minebea GmbH, Odelzhausen, Germany
P 04 Mechanical Characterisation of an Au-Ge Solder Alloy for High Temperature Electronic Devices
S. Msolli, O. Dalverny. J. Alexis, M. Karama, University of Toulouse, Tarbes, France
P 05 Evaluation of Commercial SOI Driver Performances while Operated in Extreme Conditions (150°C-200°C)
K. El Falahi, B. Allard, D. Tournier, D. Bergogne, Ampere-Lab, Villeurbanne, France
P 06 Integrated Rectenna Circuit for Microwave Power Scavenging
B. Merabet, H. Takhedmit, B. Allard, L. Cirio, F. Costa, O. Picon, C. Vollaire, Ampere-Lab, Villeurbanne, France
P 07 Fast Extraction of Dynamic Thermal Impedance for Multi-Chip Power Modules
P. Evans, C.M. Johnson, University of Nottingham, United Kingdom
P 08 Inductive Parasitics in Power Semiconductor Modules Subject to Multi-Objective Optimization
S. Förster, A. Lindemann, Otto-von-Guericke-University Magdeburg, Germany
P 09 Normally-Off AlGaN/GaN HFET with P-Type GaN Gate and AlGaN Buffer
O. Hilt, A. Knauer, F. Brunner, E. Bahat-Treidel, J. Würfl, Ferdinand-Braun-Institut, Berlin, Germany
P 10 High Temperature Electronics for High Power Density DC-DC Converters and Motor Drives
P. Delatte, V. Dessard, A. Saib, N. Pequignot, G. Picún, L. Demeûs, J.C. Doucet; T. Krebs, CISSOID S.A., Mont-Saint-Guibert, Belgium
P 11 Preliminary Study for the Integrated Design of an Electro-Mechanical Wing De-Icing System
F. Abdesselam, L. Boissy, Zodiac Aerospace, Paris, France; A. Castellazzi, T. Wijekoon, P. Wheeler, M. Johnson, University of Nottingham, United Kingdom
P 12 Thermoelectric Cooling for Power Density Maximisation of Power Electronics Converters
J. Biela, J.W. Kolar, Power Electronic Systems Laboratory, ETH Zurich, Switzerland
P 13 Design of a Multi-Cell, DCM PFC-Rectifier for a 1mm Thick, 200W Off-Line Power Supply
C. Marxgut, J. Biela, J.W. Kolar, ETH Zurich, Power Electronic Systems Laboratory, Switzerland
P 14 Knowledge Matrix for Power Electronics – The Approach of the ZVEI Working Group ‘High Temperature and Power Electronics’
M. Rittner, Robert Bosch GmbH, Schwieberdingen; A. Roth, Fraunhofer IISB, Nuremberg, Germany
P 15 1200 V 6 A SiC BJTs with very Low VCESAT and Fast Switching
A. Lindgren, M. Domeij, Transic, Kista, Sweden
P 16 System based Optimisation of the Chip Size and the Thermal Path for Si and SiC Semiconductors
T. Köneke, A. Merkert, A. Mertens, Leibnitz University Hannover, Germany
21:15 End of Dialog Session
Wednesday, March 17, 2010
Room A
Session 6: Power Electronics Applications
Chairmen: D. Boroyevich, CPES, USA; J.-H. Fabian, ABB Switzerland Ltd., Baden-Daettwil, Switzerland
8:30 Power Electronics System Integration for Electric and Hybrid Vehicles (Invited paper)
M. März, A. Schletz, B. Eckardt, S. Egelkraut, H. Rauh, Fraunhofer Institute of Integrated Systems and Devices, Erlangen, Germany
9:00 Solar Power Inverters (Invited paper)
R. Mallwitz, B. Engel, SMA Solar Technology AG, Niestetal, Germany
9:30 Fault Tolerant Drives for Aerospace Applications (Invited paper)
G. J. Atkinson, J.W. Bennet, B.C. Mecrow, D.J. Atkinson, A.G. Jack, V. Pickert, University of Newcastle, United Kingdom
10:00 Coffee Break
Session 7: Power Modules
Chairman: M. Bakran, Siemens AG, Nuremberg, Germany; J. A. Ferreira, Delft University of Technology, The Netherlands
10:30 Dynamic Paralleling Problems in IGBT Module Construction and Application (invited paper)
U. Schlapbach, ABB Switzerland Ltd. Semiconductor, Lenzburg, Switzerland
11:00 Non Destructive SOA Testing of Power Modules (Invited paper)
G. Busatto, C. Abbate, F. Iannuzzo, University of Cassino, Italy
11:30 Active Reduction of Common Mode Current in Power Modules
J.-L. Schanen, T. De Oliveira, J.-M. Guichon, G2Elab, Grenoble; S. Mandray, A. Bouzourene, Thales AES, Paris, France
11:50 Power Module with Additional Low Inductive Current Path
M. Frisch, Vincotech GmbH, Unterhaching, Germany; T. Ernö, Vincotech Kft, Bicske, Hungary
12:10 Power Circuit Design for Clean Switching
R. Bayerer, D. Domes, Infineon Technologies AG, Warstein, Germany
12:30 Lunch Break
Session 8: Power Electronics
Chairman: E. J. Dede, GH Electrotermia S.A., Valencia, Spain; M. Meinhardt, SMA, Niestetal, Germany
13:50 Development of a Mid-Power Core (35 kW) Dedicated to Inverters for Aerospace Applications
R. De Maglie, G. Osvald, A. Mashaly, S. Liebig, J. Engstler, A. Engler, Liebherr Elektronik GmbH, Lindau, Germany
14:10 Evaluation of Power Density of a Reduced Switch Count Five-Level Three-Phase PWM Rectifier for Aircraft Applications
J. Itoh, Y. Noge, Nagaoka University of Technology, Nagaoka, Niigata, Japan
14:30 Development of a Highly Compact and Efficient Solar Inverter with Silicon Carbide Transistors
C. Wilhelm, D. Kranzer, B. Burger, Fraunhofer Institute for Solar Energy System sISE, Freiburg, Germany
14:50 Mixed Switched Mode and Linear Lithium Ion Battery Tester for High Power and Large Bandwidth
M. Fischnaller, J. Melbert, Ruhr-Universität Bochum, Germany
15:10 A Linear 10 kV Power Amplifier for Piezo Actuators
T. Horn, J. Melbert, Ruhr-Universität Bochum, Germany
15:30 Coffee Break
Session 9: DC/DC Converters
Chairmen: J. A. Cobos, UPM, Spain; A. Mertens, Technical University of Hannover, Germany
16:00 Three-Stage DC-DC Converter Solutions for SMPS Applications in Comparison
U. Schwalbe, M. Scherf, T. Reimann, ISLE GmbH, Ilmenau, Germany
16:20 Fast Control Technique for High Frequency (5MHz) DC/DC Integrated Converter
M. del Viejo, P. Alou, J. A. Oliver, O. García, J. A. Cobos, Universidad Politécnica de Madrid, Spain
17:20 Break
17:30 Panel: Virtual Prototyping (CAD Tools)
D. Boroyevich, CPES, United States
D. Cottet, ABB Switzerland
U. Drofenik, ETH Zurich, Switzerland
T. Harder, ECPE e. V., Nuremberg, Germany
J.-L. Schanen, GE2Lab, Grenoble, France
G. Wachutka, Technical University Munich, Germany
Wednesday, March 17, 2010
Room B
Session 10: Packaging
Chairmen: F. P. McCluskey, University of Maryland, College Park, United States; D. Silber, University Bremen, Germany
13:50 Low Temperature Sinter Technology Die Attachment for Power Electronic Applications
C. Göbl, J. Faltenbacher, Semikron Elektronik GmbH Co. KG, Nuremberg, Germany
14:10 Pure Low Temperature Joining Technique Power Module for Automotive Production Needs
E. Schulze, C. Mertens, Volkswagen AG, Wolfsburg; A. Lindemann, Otto-von-Guericke-Universität, Magdeburg, Germany
14:30 Power Semiconductor Joining through Sintering of Silver Nanoparticles: Evaluation of Influence of Parameters Time, Temperature and Pressure on Density, Strength and Reliability
M. Knoerr, A. Schletz, Fraunhofer Institute for Integrated Systems and Devices Technology (IISB), Nuremberg, Germany
14:50 Sintering Technology Used for Interconnection of Large Areas: Potential and Limitation for Power Modules
T. Licht, R. Speckels, M. Thoben, Infineon Technologies AG, Warstein, Germany
15:10 Novel Silver Contact Paste; Lead Free Solution for Die Attach
W. Schmitt, W.C. Heraeus GmbH, Hanau, Germany
15:30 Coffee Break
Session 11: Materials
Chairmen: D. L. Saums, DS & A LLC, USA; M. Schneider-Ramelow, Fraunhofer Institute IZM, Berlin, Germany
16:00 Direct Bonded Aluminum on Aluminum Nitride Substrates via a Transient Liquid Phase and its Application
Y. Kuromitsu, Y. Nagatomo, H. Tonomura, K. Akiyama, Mitsubishi Materials Corp., Naka, Ibaraki; C. M. Montesa. N. Shibata, Y. Ikuhara, The University of Tokyo, Japan
16:20 Evaluation of Insulation Material in Advanced High Power IGBT Modules with Extended Operation Temperature
L. Feller, S. Hartmann, D. Schneider, ABB Semiconductors, Lenzburg; D. Granata, Swiss Federal Institute of Technology, Zurich; B. Behzadi, ABB Forschungszentrum Daettwil, Switzerland
16:40 Innovative Materials of Automotive Power Packaging
K. L. Tan, L. Vivet, J. M. Morelle, Valeo VEES; B. Pierre, Griset, Villiers Saint Paul; Y. Bienvenu, A. Kaabi, Armines, Evry, France
17:00 Application of Phase Change Materials for Low Duty Cycle High Peak Load Power Supplies
A. Stupar, U. Drofenik, J. W. Kolar, Power Electronic Systems Laboratory, ETH Zurich, Switzerland
17:20 Break
Room A
17:30 Panel: Virtual Prototyping (CAD Tools)
D. Boroyevich, CPES, United States
D. Cottet, ABB Switzerland
U. Drofenik, ETH Zurich, Switzerland
T. Harder, ECPE e. V., Nuremberg, Germany
J.-L. Schanen, GE2Lab, Grenoble, France
G. Wachutka, Technical University Munich, Germany
18:50 End
20:00 Conference Dinner in the City Hall Nuremberg
Thursday, March 18, 2010
Room A
Session 12: Prognostics – Thermal Management
Chairmen: F. P. McCluskey, University of Maryland, College Park, United States; J.-H. Fabian, ABB Switzerland Ltd., Baden-Daettwil, Switzerland
8:30 Current Status of Pronostics Techniques and Application to Power Electronics (Invited paper)
C. Bailey, C. Yin, H. Liu, The University of Greenwich; M. Musallam, C.M. Johnson, The University of Nottingham, United Kingdom
9:00 Validation of a Fast Loss and Temperature Simulation Method for Power Converters
A. Bryant, N-A. Parker-Allotey, I.R. Swan, D.P. Hamilton, P.A. Mawby, University of Warwick, Coventry, United Kingdom; T. Ueta, T. Nisijima, K. Hamada, Toyota Motor Corporation, Aichi, Japan
9:20 Thermal Pre-Dimensioning Methodology based on Thermal Impedance
P. Dubus, Powerlogy, Saint Forget; R. Leon, D. Le Guyader, L. Caves, Valeo, Créteil, France
9:40 A MATLAB Based Approach for Electro Thermal Design of Power Converters
P. Cova, M. Bernardoni, University of Parma, Italy
10:00 Fast and Accurate Simulation of Time-Variant Air-Cooling Systems
T. Gradinger, Y. Liu, ABB Switzerland Ltd., Baden-Dättwil, Switzerland
10:20 Coffee Break
Session 13: EMI & Cooling
Chairmen: J.-L. Schanen, G2Elab, Grenoble, France; E. Hoene, Fraunhofer Institute IZM, Berlin, Germany
10:40 Thermo-Mechanical Stress Analysis for a Multilayer SMT Manufacturing Technology
I. Josifovic, J. Popovic-Gerber, J. A. Ferreira, Delft University of Technology, The Netherlands
11:00 Investigation and PEEC Based Simulation of Radiated Emissions Produced by Power Electric Converters
A. Domurat-Linde, E. Hoene, Fraunhofer Institute IZM, Berlin, Germany
11:20 PEEC-Models for EMC Filter Layout Optimization
T. De Oliveira, J. M. Guichon, J.-L. Schanen, L. Gerbaud, G2ELab, Saint Martin d'Héres, France
11:40 Evaluation of Cooling Methods for a HVAC Drive System
F. P. McCluskey, V. Jha, R. Zimmermann, P. Hansen, University of Maryland, College Park, MD, United States
12:00 Vaporizable Dielectric Fluid Cooling for IGBT Power Semiconductors
D. L. Saums, DS & A LLC, Amesbury, United States
12:20 Lunch Break
Session 14: Future Perspectives
Chairmen: J. D. van Wyck, University of Johannesburg, South Africa; P. Friedrichs, SICED GmbH & Co.KG., Erlangen, Germany
13:40 New Semiconductor Technologies Challenge Package and System Setup (Invited paper)
G. Miller, Infineon Technolgies AG, Neubiberg am Campeon, Germany
14:10 Future Role of Power Electronics (Invited paper)
I. Omura, Kyushu Institute of Technology, Kitakyushu, Japan
14:40 Keynote: Is it the End of the Road for Silicon in Power Conversion?
A. Lidow, Efficient Power Conversion Corporation, El Segundo, United States
15:20 Closing
J. D. van Wyck, University of Johannesburg, South Africa; D. Silber, University of Bremen, Germany