Applications and system integration developments address areas such as
- transportation: automotive, railway, aircraft
- power electronics in the grid, in particular for renewable energy: wind, solar ...
- drives and power supplies
Conference Topics
- components to be integrated
- advanced Silicon devices and monolithic integration
- wide bandgap devices and monolithic integration
- drivers
- passive components
- sensors and actuators
- general aspects of packaging
- system and component packaging
- assembly concepts, embedded power, 3D integration
- new materials and interconnects
- high voltage insulation
- design for high temperature applications
- cooling concepts
- interface materials
- multi-physics CAD (electrical, thermal, mechanical) as design tool
- package types
- bare chip packaging
- discrete semiconductor packages
- hermetic semiconductor packages
- semiconductor module packages
- packages with semiconductors and passives
- mechatronic systems and their applications
- integration with sensors and actuators
- integration of PE into E-machine
- overall system optimization
- reliability
- reliability requirements, mission profiles
- physics of failure, robustness validation
- prognostics and health management
- modeling and simulation of lifetime
- intelligent reliability testing
- failure analysis
- clean switching, EMC
- parasitics and interferences, low inductance design
- electrodynamically optimized design
- optimized control through driving scheme
- filters
Who should attend
The conference will be a technical and scientific forum for engineers coming from industry and academia engages in:
- system development
- component development
- reliability engineering
- research