Members of the International Program Committee of the EMLC 2013
Conference Chair
Uwe Behringer, UBC Microelectronics, Ammerbuch, Germany
Co-Conference Chair
Naoya Hayashi, DNP, Saitama, Japan
Brid Connolly, Toppan Photomasks Inc., Dresden, Germany
Wilhelm Maurer, Infineon Technologies AG, Munich, Germany
Program Chair
Wilhelm Maurer, Infineon Technologies AG, Munich, Germany
Co-Program-Chairs
Rolf Seltmann, Globalfoundries, Dresden, Germany
Jo Finders, ASML, Veldhoven, The Netherlands
Members
Michael Arnz, Carl Zeiss SMT AG, Oberkochen, Germany
Emanuele Baracchi, ST Microelectronics, Agrate Brianza
Uwe Behringer, UBC Microelectronics, Ammerbuch, Germany
Carola Blaesing, Carl Zeiss SMS GmbH, Jena, Germany
Parkson Chen, Taiwan Mask Corp., Hsinchu,Taiwan
Brid Connolly, Toppan Photomasks Inc., Dresden, Germany
Roxann Engelstad, University of Wisconsin, Madison, WI, US
Jo Finders, ASML, Veldhoven, The Netherlands
Chris Gale, Applied Materials, Dresden, Germany
Brian J. Grenon, Grenon Consulting, Inc., Colchester, VT, USA
Naoya Hayashi, Dai Nippon Printing Co. Ltd., Saitama, Japan
Rik Jonckheere, IMEC, Leuven, Belgium
Barbara Lauche, Photronics MZD GmbH, Dresden, Germany
Hans Loeschner, IMS Nanofabrication AG, Vienna, Austria
Wilhelm Maurer, Infineon Technologies AG, Munich, Germany
Chris Progler, Photronics Inc., USA
Emmanuel Rausa, Plasma-Therm USA, St Petersburg, FL, USA
Douglas J. Resnick, Molecular Imprints, Austin, TX, USA
Klaus-Dieter Röth, KLA-Tencor MIE, Weilburg, Germany
Carmelo Romeo, Numonyx, Agrate Brianza, Italy
Hella Scheer, University of Wuppertal, Germany
Thomas Scherübl, Carl Zeiss SMS GmbH, Jena, Germany
Ronald Schnabel, VDE/VDI-GMM, Frankfurt, Germany
Steffen Schulze, Mentor Graphics Corp. Wilsonville, OR, USA
Rolf Seltmann, Globalfoundries, Dresden, Germany
Mark Staples, Globalfoundries, Dresden, Germany
Ines Stolberg, Vistec Electron Beam GmbH, Jena, Germany
Serge Tedesco, CEA-LETI, Grenoble, France
Michel Tissier, Toppan Photomasks S.A., Rousset, France
Jacques Waelpoel, ASML, Veldhoven The Netherlands
Guido Wenz, Wenz Consulting, Weil im Schoenbuch, Germany
John Whittey, KLA-Tencor, San Jose, USA
Hermann Wolf, Photronics MZD GmbH, Dresden, Germany
Stefan Wurm, SEMATECH, Albany , NY, USA
Larry Zurbrick, Agilent Technologies, Santa Clara, CA, USA