08:40 |
EUV Pellicle complete solution (Invited) |
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C. Zoldesi, B. Verbrugge, B. Verhoeven, D. Smith, D. Brouns, E. van Setten, E. Casimiri, E. Bogaart, J. Zimmerman, K. Ricken, H. Harrold, G. Bock, G. van den Bosch, J. de Hoogh, J. Hofman, J. Lima, M. Jansen, M. Leenders, M. Kruizinga, N. Harned, P. Broman, P. Janssen, P. Colsters, P. Limpens, P. Peterson, R. de Kruif, S. Houweling, T. Maas, ASML Netherlands B.V., Veldhoven, and ASML Wilton, CT, USA |
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09:10 |
Experimental Validation of Novel EUV Mask Technology to Reduce Mask 3D Effects |
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L. Van Look, V. Philipsen, E. Hendrickx, imec, Leuven, Belgium; N. Davydova, F. Wittebrood, R. de Kruif, A. van Oosten, J. Miyazaki, T. Fliervoet, J. van Schoot, ASML BV, Veldhoven, The Netherlands; J.T. Neumann, Carl Zeiss SMT GmbH, Oberkochen, Germany |
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09:30 |
Understanding the Litho-impact of Phase due to 3D Mask-Effects when using off-axis illumination |
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L. de Winter, T. Last, N. Davydova, J. Finders, ASML, Netherlands B.V., Veldhoven, The Netherlands |
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09:50 |
Understanding of Out-of-Band DUV light in EUV Lithography: Controlling Impact on Imaging and Mitigation Strategies |
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N. Davydova, R. Kottumakulal, J. Hageman, J. McNamara, R. Hoefnagels, V. Vaenkatesan, A. van Dijk, K. Ricken, L. de Winter; T. Hollink, R. de Kruif, G. Schiffelers, E. van Setten, P. Colsters, W. Liebregts, H. Ashraf, R. Pellens, J. van Dijk, ASML Netherlands B.V.,Veldhoven, The Netherlands |
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10:10 |
Coffee Break in the Winteruin Hall (at the Technical Exhibition) |
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