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EMLC 2016 - Call for Papers 

Call for Papers 

Download Call for Papers

The Call for Papers is available as a PDF file:


Abstract Information

Abstract quality will be the basis for selection of conference presentations. The abstracts will be assessed for:

  • Originality of work
  • Specific results reported
  • Potential impact and interest to the attendees.

Therefore, we highly recommend that your abstract contains enough detail to clearly describe the content of your presentation. The abstracts should include at least one full page of text (minimum of 1000 words), the use of figures is encouraged.

Commercial papers, papers with no new research / development content, and papers where significant information is missing will not be accepted. All accepted abstracts will be printed, bound and handed out to the participants of the conference.


Deadline for abstracts: Extended to April 10, 2016

By submitting an abstract you agree to

  • Present your work in person at the conference (compulsory)
  • Submit a manuscript two weeks after the conference (voluntarily)

Authors will be notified of the acceptance of their submissions by
April 30, 2016; 
further manuscript format and layout instructions will be provided at that time.



Deadline for Manuscripts: June 21, 2016

All manuscripts will be subject to a critical peer review before they are accepted for publication.

Please note: Late submissions will not be published.

The conference manuscripts will be published by the SPIE Digital Library.  

Authors must follow the SPIE manuscript preparation and submission guidelines, which are available at


All authors will submit their manuscripts to SPIE using the following link: http:/submissions/submit/overview.aspx?EventId=2241116Your manuscript is supposed to have a minimum size of six pages; please observe our writing instructions.

Conference Topics

Presentations are solicited for the following and related topics:

Mask Manufacturing

- Mask Data Preparation
- Pattern Generation: Writing, Etch, etc.
- Photomask Processes & Materials
- Metrology Tools & Technologies
- Defect Inspection & Repair
- Cleaning & Haze
- Pellicles & Mask Boxes
- Mask Process Yield & Cycle Time
- Photomasks for RET & OPC; PSM
- Masks for NGL: E-Beam, EUV, NIL, etc.


Mask Business

- Mask Business and Management
- Mask Cost and Mask Development Strategy
- Future Mask Demand


Lithography and Mask Application

- Double Patterning
- DSA (Directed Self-Assembly)
- Resist
- Mask Defect Printability
- Optical Materials
- Immersion Lithography
- Immersion Defectivity
- Alternate Immersion Fluids
- Lithography Process Control
- Lithography Simulation


Emerging Mask and Lithography Technologies

- EUV Materials, Tools & Processes
- EUV Mask Infastructure
- Direct Write / ML2, Maskless Technologies


Mask and Lithography Equipment 

Mask Manufacturing 


Semiconductors in MEMS Applications 

Patterned Media



In order to submit your abstract, please upload it here  



EMLC Abstract Submission

Deadline for Abstracts:
March 25th, 2016


 Cooperating Partners

Photomask Japan
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