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EMLC 2017 - Call for Papers 

Call for Papers 

Download Call for Papers

The Call for Papers is available as a PDF file:


Abstract Information

Abstract quality will be the basis for selection of conference presentations. The abstracts will be assessed for:

  • Originality of work
  • Specific results reported
  • Potential impact and interest to the attendees.

Therefore, we highly recommend that your abstract contains enough detail to clearly describe the content of your presentation. The abstracts should include at least one full page of text (minimum of 1000 words), the use of figures is encouraged.

Commercial papers, papers with no new research / development content, and papers where significant information is missing will not be accepted. All accepted abstracts will be printed, bound and handed out to the participants of the conference.


Deadline for abstracts: Extended to Friday, April 21, 2017

By submitting an abstract you agree to

  • Present your work in person at the conference (compulsory)
  • Submit a manuscript and/ or your presentation materials in time

Authors will be notified of the acceptance of their submissions by
April 30th, 2017; 
further manuscript format and layout instructions will be provided at that time.



Deadline for Manuscripts: June 27, 2017

All manuscripts will be subject to a critical peer review before they are accepted for publication.

Please note: Late submissions will not be published.

The conference manuscripts will be published by the SPIE Digital Library.  

Authors must follow the SPIE manuscript preparation and submission guidelines, which are available at


All authors will submit their manuscripts to SPIE using the following link: http:/submissions/submit/overview.aspx?EventId=2241116Your manuscript is supposed to have a minimum size of six pages; please observe our writing instructions.

Conference Topics

Presentations are solicited for the following and related topics:

Mask Manufacturing and Mask Business

- Mask Data Preparation
- Pattern Generation: Writing, Etch, etc.
- Photomask Processes & Materials
- Metrology Tools & Technologies
- Defect Inspection & Repair
- Cleaning & Haze
- Pellicles & Mask Boxes
- Mask Process Yield & Cycle Time
- Photomasks for RET & OPC; PSM
- Mask Business and Management
- Mask Cost and Mask Development Strategy
- Future Mask Demand


Lithography Systems and Processes

- Optical resolution enhancements including OPC, Freeform Illumination,
  Source-Mask-optimization (SMO) and Inverse Lithography Technology (ILT)
- Material-and-Process driven Resolution Enhancements including Multiple Patterning 
  and Chemical Shrinking
- Immersion Lithography including Defectivity
- Lithography Process Control
- Lithography and Etch Simulation including rigorous physical/ chemical Models and
  Compact Models


Emerging Mask and Lithography Technologies

- EUV Lithography including Masks, Materials Processes and Infrastructure
- Directed Self-Assembly (DSA) including high chi Materials, Defectivity control and new
- Direct Write/ Maskless Technologies including Multi-Beam Technologies
- Nano-Imprint Lithography (NIL), Soft Lithography and Microprinting


Emerging Applications: NEW!!!

- Non-IC Applications including Si-Photonics, flat Panel Displays and MEMS
- Lithographic Systems for non-IC Applications, including Laser Direct Write,
  Interference Lithography and Mask Aligners 


In order to submit your abstract, please upload it here  



EMLC Abstract Submission

Deadline for Abstracts:

Extended to Friday, April 21, 2017


 Cooperating Partners

Photomask Japan
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