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Keynote Papers:
- What are the big challenges in power electronics?
Johann W. Kolar, ETH Zurich, Switzerland
- Simulation and test vibration – nonlinear effects in durability of electronic systems
Abhijit Das Gupta, University of Maryland, USA
- Present and future of GaN Power Devices
Daisuke Ueda, Advanced Technology Research Laboratories, Panasonic, Japan
Invited papers:
- Power module reliability
Josef Lutz, University of Chemnitz, Germany
- Transient hygro-thermal-response of power modules in inverters-mission profiling for climate and power loading
Reinhold Bayerer, Warstein, Germany
- Power Supply With Integrated PassivEs-POWERSWIPE
Cian Ó Mathúna, Tyndall National Institute, Ireland
- Practical Aspects and Uses of Thermal Interface Material Testing Methods
David Saums, DS&A LLC, USA
- EMI and Integration
Dushan Boroyevich, Virginia Tech, USA
- Power Electronics - Key Technology for Renewable Energy Systems - Status and Future
Frede Blaabjerg, Aalborg University, Denmark
- New applications in power electronics for integrated high-speed magneto-resistive current sensors
Simon Scherner, Sensitec GmbH, Germany
- Packaging very fast switching power semiconductors
Eckart Hoene, FhG IZM, Germany
- SiC Power Electronics, Hans-Peter Nee
KTH Royal Institute of Technology, Sweden |
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