Following the committee members of ESREF 2016

ORGANIZATION COMMITTEE

General Chair:
M. Petzold, Fraunhofer IMWS-CAM (GER)

Conference Vice-Chairs:
M. Paulasto-Kröckel, Aalto University (FI)
E. Wolfgang, ECPE (GER)

Advisory board:
P. Perdu, CNES (FRA)
M. Bafleur, LAAS (FRA)
I. de Wolf, IMEC (BE)
W. Kanert, Infineon AG (GER)
B. Hellenthal, AUDI AG (GER)
E. Suhir, Portland State University (USA)

Technical Program Chairs:
F. Altmann, IMWS-CAM (GER)
E. Langer, Globalfoundries (GER)

Tutorial Chair:
P. Jacob, EMPA, (CH)

Exhibition Chair:
F. Infante, Intraspec Technologies (FR)

Publicity Chair:
J. Touzel, Infineon AG (GER)
 
Best Paper Chair:
N. Labat, IMS, University of Bordeaux (F)

Finance Chair:
V. Schanz, Information Technology Society, ITG, within VDE (GER)

Conference Organization Support:
C. Groß, VDE Conference Services (GER)
J. Kayadelen, VDE Conference Services (GER)

Local organization:
K. Stock, Fraunhofer IMWS-CAM (GER)

TECHNICAL PROGRAMME COMMITTEE

Session A
Quality and Reliability Assessment - Techniques and Methods for Devices and Systems
N. D. Stojadinovic, University of Nis (Serbia)
W. Kanert, Infineon AG (GER)

Session B
Semiconductor Reliability and Failure Mechanisms
M. Bafleur, LAAS (FRA)
O. Aubel, Globalfoundries (GER)

Session C
Reliability and Failure Mechanisms in Packaging and Assembly
H. Fremont, IMS, University of Bordeaux (FRA)
R. Rongen, NXP (NL)

Session D
Progress in Failure Analysis Methods
I. De Wolf, IMEC (BE)
W. Mack, Infineon AG (GER)

Session E
Power Devices Reliability
M. Ciappa, ETH Zurich (CH)
R. Bayerer, Infineon AG (GER)

Session F
Reliability and Failure Mechanisms of Wide Bandgap Devices
H-J. Würfl, FBH (GER)
S. Delage, III-V Lab, (FRA)

Session G
Reliability and Failure Mechanisms of special photonics and LED Devices
G. Mura, University of Cagliari (IT)
H. Brunner, Osram Licht AG (GER)

Session H
Reliability and Failure Mechanisms of MEMS and sensor systems
M. Paulasto-Kröckel, Aalto University (FI)
U. Hansen, Robert Bosch GmbH (GER)

Session I
Reliability of automotive electronics from a Systems perspective (CAM-EUFANET Industry Workshop)
S. Klengel, Fraunhofer IMWS-CAM (GER)
W. Wondrak, Daimler AG (GER)