A view on the Semiconductor Roadmap
An Steegen, Executive Vice President Semiconductor Technology & Systems, imec

Abstract

The exploding global data traffic is putting heavy demands on the network, storage, and compute centers. At the core level of the infrastructure, heat dissipation of high-performance server processor chips is a key limiter, while from application point of view there is an increasing demand to improve system performance.

In this presentation, we will reveal some of semiconductor CMOS logic and memory scaling challenges: process technologies to keep process costs under control, how design technology can help us attain the right solution. We will examine the scaling trends and review the possible paths forward for process technologies. Last but not least we will discuss how system insights, combined with technology know-how, will pave the way of the high-performance semiconductor scaling roadmap. 

curriculum vitae

An Steegen is imec’s EVP for semiconductor technology & systems. In that role, she heads the semiconductor technology & systems unit and is responsible for the next-generation CMOS & CMORE technologies R&D.

Dr. Steegen is a recognized industry leader and an acclaimed speaker at the industry’s prominent semiconductor conferences and events.

An Steegen joined imec in 2010 as senior VP responsible for imec’s CORE CMOS programs. Before, she was director at IBM Semiconductor R&D in Fishkill, New York and host executive of IBM’s logic International Semiconductor Development Alliance.

Dr. An Steegen holds a Ph.D. in Material Science and Electrical Engineering from the KU Leuven (Belgium).    

Microsensors from Bosch - Invented for Life
Franz Lärmer, Vice President, Senior Chief Expert Microsystems and Microfluidics, Robert Bosch GmbH, Corporate Sector Research and Advance Engineering
Renningen, Germany
 

Abstract

Microsystems or MEMS have revolutionized automotive safety, comfort and engine control systems. Today 100…150 microsensors can be found in a modern car. High accuracy, reliability, scalability of production technologies to high volumes and low manufacturing costs have enabled many new applications. Examples for “invented for life” are the life-saving airbag and anti-skidding systems as well as engine exhaust treatment and control. The automotive field was the first business area to provide sufficient market size and economies-of-scales, combined with appreciation of high quality, reliability and product performance, and acted as a door-opener to the success of microsensors.
Today the consumer MEMS field is adding extremely high volumes and economies-of-scales on top of the automotive MEMS business, with the Internet-of-Things-and-Services (IoTS) firing expectations towards even higher volumes. Experts are predicting a “trillion sensors future”. With a production volume of about 4.5 mio microsensors per day, Bosch has reached the leading position as the largest MEMS-supplier in the world.
The talk will describe important microsensor-families and key technologies for their mass-production. Examples for safety critical as well as consumer applications will be given.

Curriculum vitae

Dr. Franz Laermer joined the Corporate Research and Technology Center of Robert Bosch GmbH, Stuttgart, Germany, in 1990, where he started the development of new key technologies and functions for the upcoming field of Micro-Electro-Mechanical Systems (MEMS) at Bosch. His activities were mainly focused on new microstructuring, surface-micromachining and sacrificial layer etching technologies, as well as micro-accelerometers, gyroscopes and pressure sensors for the automotive area. In 1997 he became section manager at Corporate Research leading a group of 15 Researchers.

Dr. Franz Laermer managed a number of projects which laid the foundations for many generations of new microsensors at Bosch. Since 2003, he is Project Director for TOP-level innovation projects covering new application fields beyond automotive, including the biomedical area. Since 2009, he is Project Vice-President (PMP), covering the role of Senior Chief Expert for Microsystems and Microfluidics as well.

Dr. Franz Laermer is the co-inventor of the "Bosch Deep Reactive Ion Etching Process" ("BOSCH-DRIE") for microstructuring silicon. This key microstructuring technology revolutionized MEMS and is the root of all of today’s silicon based MEMS. He holds more than 150 patents.

Dr. Franz Laermer was awarded with the prize "European Inventor of the Year 2007 – Category Industry" by the European Commission and the European Patent Office (together with co-inventor Andrea Urban), for the invention, development and sustainable success of the "BOSCH-DRIE"-process. In 2014 he received the "2014 IEEE Jun-ichi Nishizawa Medal Award" from the Institute of Electrical and Electronics Engineers (IEEE), USA.