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ICPT 2017 

Committees 

International Executive Committee

China

Xinchun Lu, Tsinghua University
Xinping Qu, Fudan University

Europe

Gerfried Zwicker, Fraunhofer ISIT
Viorel Balan, CEA-LETI, France

Korea

Jin-Goo Park, Hanyang University
Haedo Jeong, Pusan National University

Taiwan, China

Chris Chern, TSMC
Willie Pai, Kinik Company

United States

Paul Feeney, Independent consultant
Robert Rhoades, Entrepix

Japan

Yukiteru Matsui, Toshiba Corp
Syuhei Kurokawa, Kyushu University

 

International Program Committee

China

Shumin Wang, Anji Microelectronics
Baoguo Zhang, Hebei University of Technology
Weili Liu, Shanghai Xinanna Electronic Technology
Kun Li, Tianjin Hwatsing Technology

Europe

Knut Gottfried, Fraunhofer ENAS, Germany
Eric Jacquinot, Merck Performance Materials, France
Patrick Ong, IMEC, Belgium
Cedric Perrot, STMicroelectronics, Crolles, France

Japan

Michio Uneda, Kanazawa Tech. Inst.
Kazumi Sugai, Fujimi Inc.
Norikazu Suzuki, Nagoya Univ.
Yasuhisa Sano, Osaka Univ.

Korea

Tae-Sung Kim, Sungkyunkwan University
Eung-Rim Hwang,SK Hynix Semiconductor
Bo Un Yoon, Samsung Electronics
Yongsun Ko, Samsung Electronics

Taiwan, China

KC Wu, Cabot Microelectronics
Tengchun Tsai, TSMC
Daniel Fang, National Taiwan University of Science and Technology
Jerry Hsu, National Taiwan University of Science and Technology

United States

S.V. Babu, Clarkson University
Mahadevaiyer Krishnan, IBM
Don Frye, Entegris

 

Local Organizing Committee 

Viorel Balan, CEA-LETI, Grenoble, France
Knut Gottfried, Fraunhofer Institute for Electronic Nano Systems ENAS, Chemnitz, Germany
Eric Jacquinot, Merck Performance Materials, Trosly-Breuil, France
Patrick Ong, IMEC, Leuven, Belgium
Cedric Perrot, STMicroelectronics, Crolles, France

Ronald Schnabel, VDE/VDI-GMM, Frankfurt am Main, Germany
Gerfried Zwicker, Fraunhofer Institute for Silicon Technology ISIT, Itzehoe, Germany

 
 
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