17:30 - 19:00 |
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Wafer Lithography
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New overlay measurement technique with an i-Line stepper using embedded standard field image alignment marks for wafer bonding applications |
P. Kulse1, K. Sasai2, K. Schulz1, M. Wietstruck1 1) IHP, Frankfurt (Oder) 2) Nikon Precision Europe GmbH, Langen, Germany
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Development and traceable calibration of a new EUV reference photomask standard |
G. Dai1, A. Ullrich2, K. Hahm1, H. Bosse1 1) Physikalisch-Technische Bundesanstalt, Braunschweig, Germany 2) Advanced Mask Technology Center GmbH & Co. KG, Dresden, Germany
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A tool for full area mapping of the transmission of thin membranes |
R. Lebert, RI Research Instruments GmbH, Bergisch Gladbach, Germany |
Limitations of spectral characterization of EUV masks and blanks: Proposition to supplement with inband mapping |
R. Lebert, C. Phiesel, A. Biermanns-Föth, T. Missalla, C. Pampfer, C. Piel, RI Research Instruments GmbH, Bergisch Gladbach, Germany |
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Mask Patterning, Metrology and Process |
Half circle chrome loss by electrochemical effects |
D. Caspary, S. Jähne, P. Nesladek, M. Kristlib, L. Bahrig, A. Feicke, M. Kaiser, J. Lorbeer, T. Wandel, AMTC, Dresden, Germany
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Characterizing electron beam induced damage in metrology and inspection of advance devices |
A. Mohtashami1, V. Navarro1, H. Sadeghian1, I. Englard2, D. Shemesh2, N. Singh Malik2 1) Netherlands Organization for Scientific Applied Research, TNO, Delft, The Netherlands 2) Process Diagnostics and Control, Applied Materials, Israel |
Aerial Image metrology for OPC modeling and mask qualification |
A. Chen1, Y. M. Foong1, T. Thaler2, U. Buttgereit2, A. Chung3, A. Burbine4, J. Sturtevant4, C. Clifford5, K. Adam5, P. De Bisschop6 1) Globalfoundries Singapore 2) Zeiss, Jena, Germany 3) Mentor Graphics, Singapore 4) Mentor Graphics, OR, USA 5) Mentor Graphics, CA,USA 6) IMEC, Leuven, Belgium
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Non-IC Applications |
Two photon crosslinking for the fabrication of swollen microstructures |
D. Schwärzle, O. Prucker, J. Rühe, IMTEK, University of Freiburg, Germany
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Experimental verification of Sub-Wavelength Holographic Lithography physical concept for single exposure fabrication of complex structures on planar and nonplanar surfaces |
M.V. Borisov , D.A. Chelyubeev, V.V. Chernik, P.A. Miheev, V.I. Rakhovskiі, A.S. Shamaev, Nanotech SWHL Ltd., Dübendorf, Switzerland
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Nano-Imprint-Lithography |
High-Speed Roll-to-Roll hot embossing of PET foils using seamless Direct Laser Interference Patterning treated sleeves |
A. Rank1, V. Lang1,2, A. F. Lasagni1,2 1) Technische Universität Dresden, Germany 2) Fraunhofer Institute for Material and Beam Technology, Dresden, Germany |
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Function Follows Form: Combining Nanoimprint and Inkjet Printing |
M. Muehlberger, M. Haslinger, J. Kurzmann, A. Moharana, A. Fuchsbauer, H. Ausserhuber, J. Kastner, D. Fechtig, Profactor GmbH, Steyr-Gleink, Austria |
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Mask2Wafer Metrology |
Pattern sampling for etch model calibration |
F. Weisbuch, A. Lutich, J. Schatz, Globalfoundries, Dresden, Germany |
LMS IPRO: Enabling on-device metrology on SiN-based Phase-Shift Masks |
H. Steigerwald, R. Han, A. Buettner, K.-D. Roeth, KLA-Tencor MIE GmbH, Germany
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Photonics |
Microlenses for CMOS-Technologies |
B. Pötschick, Infineon Technologies Dresden GmbH, Dresden, Germany |
Contact-free polishing and soft-lithography replication process for 3D polymer micro-optics |
R. Kirchner1,3, N. Chidambaram1, M. Altana2, H. Schift1 1) Paul Scherrer Institute, LMN, Villigen, Switzerland 2) Heptagon Oy, Rueschlikon, Switzerland 3) Technische Universtität Dresden, Germany
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