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EMLC 2010 


Members of the International Steering Committee,
the International Program Committee(*)
and the Local Committee of the EMLC 2010


Conference Chair:           Dr. U. Behringer (*), UBC Microelectronics, Ammerbuch, Germany

Co-Conference Chairs:    Mr. B. Grenon (*),  Grenon Consulting, Colchester, VT, USA
                                        Mr. N. Hayashi (*), DNP, 
Saitama, Japan

Program Chairs:              Dr. W. Maurer (*), Infineon Technologies AG, Munich, Germany
                                        J. Waelpoel (*), ASML, Veldhoven,
The Netherlands

Co-Program Chair:          Mr. W. Montgomery (*), SEMATECH, Albany, NY, USA 


Dr. M. Arnz, Carl Zeiss SMT AG, Oberkochen, Germany (*)

Dr. C. Blaesing, Carl Zeiss SMS GmbH, Jena, Germany

Mr. P. Chen, Taiwan Mask Corp., Hsinchu,Taiwan (*)

Dr. C. Constantine, Oerlikon USA Inc., St. Petersburg, FL, USA(*)

Prof. R. Engelstad, University of Wisconsin, Madison, WI, USA (*)

Mr. B.G. Eynon, Molecular Imprints, Austin, TX, USA (*)

Mr. C. Gale, Applied Materials, Dresden, Germany (*)

Mr. B. Grenon, Grenon Consulting, Inc., Colchester,VT, USA (*)

Mr. N. Hayashi, Dai Nippon Printing Co. Ltd., Saitama, Japan (*)

Mr. R. Jonckheere, IMEC, Leuven, Belgium (*)

Ms. B. Lauche, Photronics MZD GmbH, Dresden, Germany

Dr. H. Loeschner, IMS Nanofabrication AG, Vienna, Austria (*)

Dr. W. Montgomery, SEMATECH, Albany, NY, USA

Mrs. V. Pequignat, AEPI, Grenoble, France

Dr. Ch. Pierrat, Cadence Design Systems Inc., San Jose, USA (*)

Mr. E. Rausa, Oerlikon USA Inc., Saint Petersburg, FL, USA (*)

Dr. C. Reita, CEA/Léti, Grenoble, France

Mr. D. J. Resnick, Molecular Imprints, Austin, TX, USA (*)

Dr. F. Reuther, micro resist technology GmbH, Berlin, Germany

Dr. C. Romeo, Numonyx, Agrate Brianza, Italy (*)

Mr. K. Ronse, IMEC, Leuven, Belgium

Prof. H. Scheer, University of Wuppertal, Germany (*)

Dr. R. Schnabel, VDE/VDI-GMM, Frankfurt, Germany (*)

Mr. M. Staples, GLOBALFOUNDRIES, Dresden, Germany

Mrs. I. Stolberg, Vistec Electron Beam GmbH, Jena, Germany (*)

Dr. S. Tedesco, CEA/Léti, Grenoble, France (*)

Dr. M. Tissier, Toppan Photomasks S.A., Rousset, France (*)

Mr. J.T. Weed, SYNOPSYS Inc., Mountain View, CA, USA

Mr. J. Whittey, KLA-Tencor, Oakdale, CA, USA (*)

Mr. H. Wolf, Photronics MZD GmbH, Dresden, Germany (*)

Mr. S. Wurm, SEMATECH, Albany , NY, USA (*)

Mr. L. Zurbrick, Agilent Technologies, Santa Clara, CA, USA (*)


 Cooperating Partner

Cea leti
Aepi Grenoble Isere

 Sponsoring Societies

Semiconductor Equipment and Materials International
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