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European Mask and Lithography Conference  

Committees 

Members of the International Steering Committee of the “European Mask and Lithography Conference”, EMLC and Members of the International Program Committee of the EMLC 2011(*).

 

 Conference Chair:

 U. Behringer (*), UBC Microelectronics, Ammerbuch, Germany

 Co-Conference Chairs:
 

 N. Hayashi (*), DNP, Saitama, Japan
 C. Gale, Applied Materials, Dresden, Germany

 Program Chairs:
 

 R. Seltmann, Globalfoundries, Dresden, Germany
 J. Waelpoel (*), ASML, Veldhoven, The Netherlands

 Co-Program Chair:
 

 W. Montgomery (*), SEMATECH,
  Albany, NY, USA

 

F. Abboud, Intel Corp., Santa Clara, CA, USA

M. Arnz, Carl Zeiss SMT AG, Oberkochen, Germany (*)

E. Baracchi, ST Microelectronics, Agrate Brianza, Italy

C. Blaesing, Carl Zeiss SMS GmbH, Jena, Germany (*)

P. Chen, Taiwan Mask Corp., Hsinchu,Taiwan (*)

R. Engelstad, University of Wisconsin, Madison, WI, USA (*)

D. Farrar, HOYA Corporation, LONDON, UK

C. Gale, Applied Materials, Dresden,Germany (*)

B. Grenon, Grenon Consulting, Rochester, VT, USA (*)

G. Hughes, SEMATECH, Albany, NY, USA (*)

R. Jonckheere, IMEC, Leuven, Belgium (*)

K. Kimmel, SEMATECH, Albany, NY, USA

B. Lauche, Photronics MZD GMbH, Dresden, Germany(*)

H. Loeschner, IMS Nanofabrication AG, Vienna, Austria (*)

W. Maurer, Infineon Technologies AG, Munich, Germany

V. Pequignat, AEPL, Grenoble, France

C. Progler, Photronics, San Jose, CA, USA

E. Rausa, Plasmatherm, Saint Petersburg, FL, USA (*)

D. J. Resnick, Molecular Imprints, Austin, TX, USA (*)

F. Reuther, micro resist technology GmbH, Berlin, Germany

C. Romeo, Numonyx, Agrate Brianza, Italy (*)

K. Ronse, IMEC, Leuven, Belgium

H. Scheer, University of Wuppertal, Germany (*)

T. Scherübl, Carl Zeiss SMS GmbH, Jena, Germany (*)

G. Scheuring, Mue Tec GmbH, Munich, Germany

R. Schnabel, VDE/VDI-GMM, Frankfurt, Germany (*)

M. Staples, Globalfoundries, Dresden, Germany (*)

I. Stolberg, Vistec Electron Beam GmbH, Jena, Germany (*)

S. Tedesco, CEA-LETI, Grenoble, France (*)

M. Tissier, Toppan Photomasks S.A., Rousset, France (*)

J. T. Weed, Synopsys Inc., Mountain View, CA, USA (*)

J. Whittey, KLA-Tencor, Oakdale, USA (*)

H. Wolf, Photronics MZD GmbH, Dresden, Germany (*)

S. Wurm, SEMATECH, Albany, NY, USA(*)

L. Zurbrick, Agilent Technologies, Santa Clara, CA, USA (*)

 Cooperating Partner

UBC Microelectronics
Bacus

 Sponsoring Societies

Photomask Japan
Semiconductor Equipment and Materials International
SPIE
 
 
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