Members of the International Steering Committee of the “European Mask and Lithography Conference”, EMLC and Members of the International Program Committee of the EMLC 2011(*).
Conference Chair: |
U. Behringer (*), UBC Microelectronics, Ammerbuch, Germany |
Co-Conference Chairs: |
N. Hayashi (*), DNP, Saitama, Japan C. Gale, Applied Materials, Dresden, Germany |
Program Chairs: |
R. Seltmann, Globalfoundries, Dresden, Germany J. Waelpoel (*), ASML, Veldhoven, The Netherlands |
Co-Program Chair: |
W. Montgomery (*), SEMATECH, Albany, NY, USA |
F. Abboud, Intel Corp., Santa Clara, CA, USA
M. Arnz, Carl Zeiss SMT AG, Oberkochen, Germany (*)
E. Baracchi, ST Microelectronics, Agrate Brianza, Italy
C. Blaesing, Carl Zeiss SMS GmbH, Jena, Germany (*)
P. Chen, Taiwan Mask Corp., Hsinchu,Taiwan (*)
R. Engelstad, University of Wisconsin, Madison, WI, USA (*)
D. Farrar, HOYA Corporation, LONDON, UK
C. Gale, Applied Materials, Dresden,Germany (*)
B. Grenon, Grenon Consulting, Rochester, VT, USA (*)
G. Hughes, SEMATECH, Albany, NY, USA (*)
R. Jonckheere, IMEC, Leuven, Belgium (*)
K. Kimmel, SEMATECH, Albany, NY, USA
B. Lauche, Photronics MZD GMbH, Dresden, Germany(*)
H. Loeschner, IMS Nanofabrication AG, Vienna, Austria (*)
W. Maurer, Infineon Technologies AG, Munich, Germany
V. Pequignat, AEPL, Grenoble, France
C. Progler, Photronics, San Jose, CA, USA
E. Rausa, Plasmatherm, Saint Petersburg, FL, USA (*)
D. J. Resnick, Molecular Imprints, Austin, TX, USA (*)
F. Reuther, micro resist technology GmbH, Berlin, Germany
C. Romeo, Numonyx, Agrate Brianza, Italy (*)
K. Ronse, IMEC, Leuven, Belgium
H. Scheer, University of Wuppertal, Germany (*)
T. Scherübl, Carl Zeiss SMS GmbH, Jena, Germany (*)
G. Scheuring, Mue Tec GmbH, Munich, Germany
R. Schnabel, VDE/VDI-GMM, Frankfurt, Germany (*)
M. Staples, Globalfoundries, Dresden, Germany (*)
I. Stolberg, Vistec Electron Beam GmbH, Jena, Germany (*)
S. Tedesco, CEA-LETI, Grenoble, France (*)
M. Tissier, Toppan Photomasks S.A., Rousset, France (*)
J. T. Weed, Synopsys Inc., Mountain View, CA, USA (*)
J. Whittey, KLA-Tencor, Oakdale, USA (*)
H. Wolf, Photronics MZD GmbH, Dresden, Germany (*)
S. Wurm, SEMATECH, Albany, NY, USA(*)
L. Zurbrick, Agilent Technologies, Santa Clara, CA, USA (*)