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CIPS 2014, February 25-27, Nuremberg / Germany 

Press Release 

8th International Conference on Integrated Power Electronics Systems



Higher power efficiency, density, reliability, and lower volume and cost: How to reach this goals and what solutions are feasible will be discussed again at the 8th CIPS by power electronics experts coming from all over the world.

The conference is organized by VDE ETG and ECPE and technically co-sponsored by the IEEE PELS and ZVEI. The conference papers did undergo a peer review process which allows their storage in the IEEE Xplore digital data base. The Technical Programme Committee has selected 81 papers to be presented; 29 of them will be poster presentations. The best poster as well as the best young engineers presentation will be awarded.

As usual for CIPS there is a frame of 3 Keynotes and 9 Invited Papers given by worldwide leading experts:

Keynote Papers

  • What are the big challenges in power electronics?
    Johann W. Kolar, ETH Zurich, Switzerland
  • Simulation and test vibration – nonlinear effects in durability of electronic systems
    Abhijit Das Gupta, University of Maryland, USA
  • Present and future of GaN Power Devices
    Daisuke Ueda, Advanced Technology Research Laboratories, Panasonic, Japan

Invited papers

  • Power module reliability
    Josef Lutz, University of Chemnitz, Germany
  • Transient hygro-thermal-response of power modules in inverters-mission profiling for climate and power loading
    Reinhold Bayerer, Warstein, Germany
  • Power Supply With Integrated PassivEs-POWERSWIPE
    Cian Ó Mathúna, Tyndall National Institute, Ireland
  • Practical Aspects and Uses of Thermal Interface Material Testing Methods
    David Saums, DS&A LLC, USA
  • EMI and Integration
    Dushan Boroyevich, Virginia Tech, USA
  • Power Electronics - Key Technology for Renewable Energy Systems - Status and Future
    Frede Blaabjerg, Aalborg University, Denmark
  • New applications in power electronics for integrated high-speed magneto-resistive current sensors
    Simon Scherner,  Sensitec GmbH, Germany
  • Packaging very fast switching power semiconductors
    Eckart Hoene, FhG IZM, Germany
  • SiC Power Electronics
    Hans-Peter Nee, KTH Royal Institute of Technology, Sweden


We kindly invite to join CIPS 2014. Program and online registration are avaible on . Early bird fee by January 23rd, 2014 !

Participants especially from universities and research institutions are invited to present results and demonstrators from current research in the Table Top Exhibition. Please find more information on the homepage .

Prof. Leo Lorenz, General Chair (center), 
Eckhard Wolfgang, ECPE (right) and Hans-Dieter Silber, University of Bremen,
Technical Program Chairs (left)


VDE-Conference Services
Mrs. Hatice Altintas
Stresemannallee 15
60596 Frankfurt - Germany
Phone: +49 69 6308-477
Fax: +49 69 6308-144
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