Skip Navigation LinksCIPS 2014 Table Top Exhibition

CIPS 2014 

Table Top Exhibition 



ECPE - Petri 



The following companies and institutions are pleased to welcome you at the Table Top Exhibition


Exhibitors 2014

Boschman Technologies BV, Duiven, NL

Boschman Technologies is the supplier of automatic molding systems using Film Assisted Molding (FAM) technology.Power Packages on lead frame or on  DBC  where  heat sinks,  exposed die surfaces must be kept free of mold compound  are ideally suited for the   technology. The technology of friendely clamping is also used for silver sintering  process.
Dowa HD Europe GmbH, Nürnberg, DE
DOWA Metaltech has over 30 years of experience in  development and manufacturing of metal-ceramic substrates (AMB, DAB, DBC) . For minimizing module costs and excellent module performance under harsh conditions DOWA developed the Integrated Substrate.
DOWA Electronics Materials is a global leading manufacturer of Ag-powders for micro- to nano-scaled sizes. Based on this knowledge DOWA developed innovative low temperature Power Sintering  Pastes  which can be used for low-pressure and pressureless Ag sintering on noble- as well as Cu-surfaces.
For further details we welcome your visit on our booth.

DuPont (UK) Ltd, Bristol, UK

DuPont Microcircuit Materials has 50 years of experience in the development, manufacture and sale of specialized pastes for a wide variety of applications in the display, appliance, photovoltaic, automotive, biomedical, telecommunication and consumer electronics markets. We will exhibit a new low temperature sintering Ag chip attach paste at CIPS 2014.

ECPE e.V. Nürnberg, DE

ECPE European Center for Power Electronics is an industry-driven Research Network in the field of Power Electronics with about 150 member organisations in Europe, comprising Member companies and Competence Centres. It was founded in 2003 by leading power electronics industries in order to promote research, education and public relations in this field.

Fraunhofer Institute for Mechanics of Materials IWM, Halle (Saale), DE

Fraunhofer CAM We provide failure analysis for power semiconductors, including power ICs, power MOS transistors, IGBT and diodes as well as for ICs and sensors developed for high temperature operation conditions. In addition to current Si-based systems we analyze microstructural properties of innovative components based on SiC /GaN materials and related dielectrics; metallization and contact systems, particularly after high temperature stressing or power cycling.
Specific attention is paid to understanding material properties and securing reliability when applying new interconnecting and packaging approaches, e.g. heavy wire bonding materials, Ag sintering, transient liquid phase bonding, reactive wafer bonding or new substrate materials. We collaborate with manufacturers developing methods and tools for quality control and failure analysis.
Gecko-Simulations AG, Zurich, CH
Gecko-Simulations AG is developing software tools for multi-domain numerical simulation and design of power electronic systems. In addition, consulting services for power electronics engineering are offered. Gecko-Simulations currently offers the circuit simulator GeckoCIRCUITS and the magnetic design tool GeckoMAGNETICS.

Hoffmann & Co Elektrokohle AG, Bad Goisern, AT

From the day it was founded in 1946, Hoffmann Elektrokohle has specialized in the development and production of graphite products.
Aluminium Graphite, a high-tech metal matrix composite (MMC), can be used in electronic modules and increases the reliability of electronic systems via its ideal thermal properties, as required by emerging industries.

Ingenieurbüro Billmann, Emskirchen, DE
Since 1991, we have been supporting the industry with design, evaluation and consulting in the field of power electronic systems.
We are distributor and European application office for high bandwidth coaxial shunts, also known as current viewing resistors. In the area of test equipment, we develop special tools and adapters that are tailored to the requirements of power electronics. We also sell a number of self-designed units, which greatly shorten laboratory setup times.
We provide failure analysis and design reviews. Customers benefit from our decades of experience and from the background of latest R&D research topics. We deliver technology from customized single pieces, over small series, to developments facing a planned high volume production. We carry out design, prototyping, as well as functional testing and support you in the series overpass.

Kyushu Institute of Technology Kitakyushu, Fukuoka, JP

Power electronics research activity in Kyushu Institute of Technology (Japan) focuses on novel power semiconductor design including IGBTs and diodes, high-temperature power integrated circuits, digital control techniques for power devices, and real-time imaging for failure analysis intended for power devices. We will explain our activity in the table top exhibition.

Plexim GmbH, Zürich (CH)

The Simulation Platform for Power Electronic Systems

Uptime Engineering, Graz, AT

We provide consulting and software for system reliability.
Apart from the technical aspects of validation we cover and support also the required processes. Our software suite Uptime Solutions™ empowers customers to design and perform cost-effective tests and validation programs with full transparency of progress and target achievement. Fleet operators use Uptime Solutions™ for condition based maintenance in order to ensure the maximum operational revenue.
We are a team of engineers from various backgrounds and industries offering a broad range of expertise with common focus on test design, validation process and program optimization.  We rely on applied statistics, physics of failure and materials technology.
We support our customers to work independently with the reassurance that processes, tools and methods remain permanently at the highest quality level. Our services and software tools are used by OEMs and fleet operators in several industries including cars, commercial vehicles, construction machinery, railway, wind-energy.



In this "poster session with hardware demonstration" results and demonstrators from current research at universities and research institutions will be presented.

As a part of the conference, the table top exhibition will take place in the same area as the Poster-Session and the coffee and lunch breaks.

Take the opportunity to present your products

The Booth package fee of 960 EUR (+VAT) includes:

  • 3 x 2 m booth: raw space without side and back walls;
    (double-booths 6 x 2 m available on request)
  • 1 full conference registration
  • 1 skirted table, 2 chairs
  • standard 230V/10 A electrical outlet
  • logo and 50 words company profile in the conference program and website

Booth Reservation

In order to secure your exhibition space at CIPS 2014 click here for online booking!

Exhibit space is available on first come first served basis. Additional equipment and further advertisement opportunities can be arranged on request. 

Make your booth reservation in order to guarantee the opportunity to represent your company and demonstrate its products at CIPS!

When processing with your booth registration, please send us your company logo as jpg file as well as your url address and a short description (max 50 words) of your company and your products to Mr. Altintas - contact see above.



VDE-Conference Services
Mrs. Hatice Altintas
Stresemannallee 15
60596 Frankfurt - Germany
Phone: +49 69 6308-477
Fax: +49 69 6308-144
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