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Conference Program 




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 Keynote - Invited Papers

Keynote Papers:

  • What are the big challenges in power electronics?
    Johann W. Kolar, ETH Zurich, Switzerland
  • Simulation and test vibration – nonlinear effects in durability of electronic systems
    Abhijit Das Gupta, University of Maryland, USA
  • Present and future of GaN Power Devices
    Daisuke Ueda, Advanced Technology Research Laboratories, Panasonic, Japan

Invited papers:

  • Power module reliability
    Josef Lutz, University of Chemnitz, Germany
  • Transient hygro-thermal-response of power modules in inverters-mission profiling for climate and power loading
    Reinhold Bayerer, Warstein, Germany
  • Power Supply With Integrated PassivEs-POWERSWIPE
    Cian Ó Mathúna, Tyndall National Institute, Ireland
  • Practical Aspects and Uses of Thermal Interface Material Testing Methods
    David Saums, DS&A LLC, USA
  • EMI and Integration
    Dushan Boroyevich, Virginia Tech, USA
  • Power Electronics - Key Technology for Renewable Energy Systems - Status and Future
    Frede Blaabjerg, Aalborg University, Denmark
  • New applications in power electronics for integrated high-speed magneto-resistive current sensors
    Simon Scherner,  Sensitec GmbH, Germany
  • Packaging very fast switching power semiconductors
    Eckart Hoene, FhG IZM, Germany
  • SiC Power Electronics, Hans-Peter Nee
    KTH Royal Institute of Technology, Sweden

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