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CIPS 2012 

 

Conference Program

 

   

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Keynote Papers

  • Extreme Efficiency Power Electronics
    Johann W. Kolar, ETH Zurich,  Switzerland
  • Reliability of Power Electronics Under Thermal Loading
    Patrick McCluskey, University of Maryland, USA
  • SiC Device and Power Module Technologies for Environmentally Friendly Vehicles
    Kimimori Hamada, Toyota Motor Corporation, Japan

Invited papers

  • Advanced Cooling for Power Electronics
    Sukhvinder Kang, Aavid, USA
  • Analysis of Innovative Packaging Technologies and Trends for Power Modules
    Alexandre Avron, Yole Développement , France
  • Electromagnetic Modeling of EMI Input Filters
    Andreas Muesing, Gecko Research GmbH, Switzerland
  • On-chip System Integration
    Ashraf Lofti, Enpirion Inc. USA
  • Combined Reliability Testing: An Approach to Ensure Reliability Under Complex Loading Conditions
    Olaf Wittler, Fraunhofer IZM, Germany
  • Integrated High Power Modules
    C. Mark Johnson, University of  Nottingham, UK
  • SiC and GaN Devices – Competition or Coexistence?
    Nando Kaminski, University of Bremen, Oliver Hilt, FBI Berlin, Germany
  • Planar Interconnect Technology for Power Module System Integration 
    Norbert Seliger, University of Applied Sciences Rosenheim, Karl Weidner, Siemens CT, Germany
  • Reliability of the Planar Skin Interconnect Technology
    Uwe Scheuermann, Semikron, Germany

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