Keynote Papers

• Extreme Efficiency Power Electronics
  Johann W. Kolar, ETH Zurich,  Switzerland
• Reliability of Power Electronics Under Thermal Loading
  Patrick McCluskey, University of Maryland, USA
• SiC Device and Power Module Technologies for Environmentally Friendly Vehicles
  Kimimori Hamada, Toyota Motor Corporation, Japan

Invited papers

• Advanced Cooling for Power Electronics
  Sukhvinder Kang, Aavid, USA
• Analysis of Innovative Packaging Technologies and Trends for Power Modules
  Alexandre Avron, Yole Développement , France
• Electromagnetic Modeling of EMI Input Filters
  Andreas Muesing, Gecko Research GmbH, Switzerland
• On-chip System Integration
  Ashraf Lofti, Enpirion Inc. USA
• Combined Reliability Testing: An Approach to Ensure Reliability Under Complex Loading Conditions
  Olaf Wittler, Fraunhofer IZM, Germany
• Integrated High Power Modules
  C. Mark Johnson, University of  Nottingham, UK
• SiC and GaN Devices – Competition or Coexistence?
  Nando Kaminski, University of Bremen, Oliver Hilt, FBI Berlin, Germany
• Planar Interconnect Technology for Power Module System Integration 
  Norbert Seliger, University of Applied Sciences Rosenheim, Karl Weidner, Siemens CT, Germany
• Reliability of the Planar Skin Interconnect Technology
  Uwe Scheuermann, Semikron, Germany