Committees 

ESREF 2014 

25th EUROPEAN SYMPOSIUM ON RELIABILITY OF ELECTRON DEVICES,
FAILURE PHYSICS AND ANALYSIS

ORGANIZING COMMITTEE

Conference Chair:
C. BOIT TUB - Tech. University of Berlin (GER)

Conference Vice-Chairs:
K.D. LANG Fraunhofer IZM (GER)
G. TRÄNKLE FBH - Ferdinand-Braun-Institut (GER)

Technical Program Chairs:
E. LANGER GLOBALFOUNDRIES (GER)
E. WOLFGANG ECPE (GER)

Tutorial and Workshop Chairs:
Ph. PERDU CNES (FRA)
G. TOUZEL Infineon (GER)

Exhibition Chair:
J. GAUDESTAD Neocera (USA)

Publicity and IT Chair:
Ph. SCHOLZ TUB - Tech. University of Berlin (GER)

Finance Chair:
V. SCHANZ Information Technology Society, ITG, within VDE (GER)

Conference Support:
C. GROSS VDE Conference Services (GER)
J. KAYADELEN VDE Conference Services (GER)


TECHNICAL PROGRAMME COMMITTEE

Topic A: Quality and Reliability Assessment – Techniques and
Methods for Devices and Systems
F. FANTINI University of Modena and Reggio Emilia (IT)
W. KANERT Infineon (GER)

Topic B: Failure Analysis
S. GÖRLICH Infineon (GER)
R. SCHLANGEN Nvidia (USA)

Topic C: Si-Technology - Nanoelectronics
M. BAFLEUR LAAS (FRA)
O. AUBEL GLOBALFOUNDRIES (GER)

Topic D: Packages & Assembly
H. FREMONT IMS, University of Bordeaux (FRA)
K. WEIDE-ZAAGE University of Hannover (GER)

Topic E: Power Devices Reliability
R. BAYERER Infineon (GER)
M. CIAPPA ETH Zürich (CHE)

Topic F: Chip-Package Interaction + 3D
I. de WOLF IMEC (BE)
M. HECKER GLOBALFOUNDRIES (GER)

Topic G: Wide Bandgap Reliability
M. UREN University of Bristol (UK)

Topic H: Photonic and Special Devices (MEMS, PV ...)
F. ALTMANN Fraunhofer IWM Halle (GER)
M. VANZI University of Cagliari (IT)

Topic I: Organic Devices
T. RIEDL University of Wuppertal (GER)

Topic J: European FIB User Group (EFUG)
H. BENDER IMEC (BE)
F. ALTMANN Fraunhofer IWM Halle (GER)

 

STEERING COMMITTEE

A. BENSOUSSAN THALES, Alenia Space, France
J. BISSCHOP NXP, Semiconductors, The Netherlands
C. BOIT TUB, Tech. University of Berlin, Germany
G. BUSATTO, University of Cassino, Italy
M. CIAPPA, ETH, Zürich Switzerland
Y. DANTO IMS, University of Bordeaux, France
I. De WOLF, IMEC, Belgium
G. ERIKSEN, GRUNDFOS, Denmark
F. FANTINI, University of Modena, Italy
B. FOUCHER, EADS, France
W. GERLING, ECPE, Germany
S. GOERLICH, Infineon, Germany
R. HEIDERHOFF, University of Wuppertal, Germany
N. LABAT IMS, University of Bordeaux, France
J.R. LLOYD, University of Albany, USA
G. MENEGHESSO, University of Padova, Italy
E. MIRANDA, University Autonoma Barcelona, Spain
J.L. MURARO, THALES Alenia Space, France
G. PAPAIOANNOU, University of Athens, Greece
Ph. PERDU, CNES, France
C. SALM, University of Twente, The Netherlands
N. STOJADINOVIC, University of Nis, Serbia
A. TOUBOUL IMS, University of Bordeaux, France
M. VANZI, University of Cagliari, Italy
E. WOLFGANG, ECPE, Germany
W. WONDRAK, Daimler Chrysler, Germany
 
 
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