4th Optical Interconnect in Data Centers EU-Symposium 

4th Optical Interconnect in Data Centers EU-Symposium 

 

 

Sunday, September 18 

09:00 - 18:00

4th Optical Interconnect in Data Centers EU-Symposium

Tolga Tekin (Fraunhofer IZM / TU Berlin, Germany)
Richard Pitwon (Seagate, United Kingdom)
Nikos Pleros (AUTH, Greece)
Emmanouel Varvarigos (CTI ‘Diophantus’, Greece)
Dimitris Apostolopoulos (ICCS / NTUA, Greece)

 

Abstract:

The symposium is focused on high-performance, low-energy and cost and small-size optical interconnects across the different hierarchy levels in data center. The proliferation of mobile data applications is causing a dramatic shift in the location in which data is stored from client based or mobile storage to Cloud data centres with projections that around 60% of all data will be stored in the Cloud by 2020.
The projected increase in capacity, processing power and bandwidth density in data centre environments must be addressed by the migration of high density optical interconnect into the data communication enclosures. The conversion point between electrical to optical interconnects will move ever closer to the on-board processing complexes, whether these be CPUs, data storage controllers, FPGAs, routers or switches. This migration is already strongly reflected in the research, development and strategic activities of mainstream organisations in the data centre and broader ICT space and the emergence of a new technology eco-system.
This technology migration is already strongly reflected in the research, development and strategic activities of mainstream organisations in the data centre and broader ICT space and the emergence of a new technology eco-system.
Motivated by recent breakthroughs and emerging technologies in short reach optical interconnect and the evolution of data centre architectures, this symposium aims to highlight the latest achievements on optical system solutions and architectures, that are placing photonics among the key enabling technologies of datacom and computercom evolution.
We intend to draw out and discuss the key technology enablers and inhibitors to widespread commercial proliferation of photonic interconnect in “mega” data centre environments and how the optical interconnect community can collectively help to address these.
The topics addressed will centre on passive and active embedded photonic interconnect technologies including optical circuit boards, polymer and glass waveguides, III-Vs, silicon photonics, photonic crystals and plasmonics in data centers.

Previous Symposia:
3rd Optical Interconnect in Data Centers Symposium, ECOC 2015, Valencia
2nd Optical Interconnect in Data Centers Symposium, ECOC 2014, Cannes
1st Optical Interconnect in Data Centers Symposium, Laser Optics Berlin 2014

 

ECOC 2016 PhoxTrot

 Affiliation:

PhoxTroT.eu is focusing on on-board, board-to-board and rack-to-rack optical interconnects. The goal of this large-scale EU research effort is the deployment of optimized technologies to tailor dedicated interconnect layers towards high-performance, low-energy and low-cost Data Center and High-Performance Computing Systems. A "mix & match" technology by synergizing the different fabrication platforms such as CMOS electronics, Si-photonics, polymers, glass, III-Vs, and plasmonics will enable generic building blocks (transmitters, modulators, receivers, switches, optochips, multi- and single-mode optical PCBs, chip- and board-to-board connectors) to extend the performance beyond Tb/s and to reduce the energy by more than 50%.
PhoxTroT is a European Union-funded IP project. Grant agreement no: 318240. European Commission, Seventh Framework Program (FP7), ICT - Information and Communication Technologies; http://cordis.europa.eu/fp7/ict
 

 

ECOC 2016 PhoxTrot     ECOC 2016 PhoxTrot

ECOC 2016 PhoxTrot     ECOC 2016 PhoxTrot

Speakers

Welcome
Tolga Tekin (PhoxTroT)

 

Session 1: The end-user perspective

Advances in photonic interconnect for data centre subsystems
Richard Pitwon (Seagate, UK)

tbd
Katharine Schmidtke (Facebook)

PIC Technologies for Intra- and Inter- Distributed DC and Cloud-Access  Ultra-High Capacity Flex OTN
Elad Mentovich (Mellanox)


System and Device-level Integration Trends of Optical Interconnects in Data Centres
Bert Offrein (IBM Research)

Round table discussion
Coffee Break

 

Session 2:  Bringing technology to market I

tbd
Marika Immonen (TTM Mail)

ams and Silicon Photonics - From Research to Business
Joni Mellin (ams)

Embracing diversity: hybrid integration for data center optics
Susannah Heck (Kaiam Corporation, USA)

Silicon photonics transceivers for hyper-scale datacenters: Deployment and roadmap
Peter De Dobbelaere (Luxtera)

tbd
Lê Nguyên Bình (Huawei Technologies Ltd., GER)

Round table discussion
Lunch Break

 

Session 3: Bringing technology to market IItbd
Hideyuki Nasu (Furukawa)

Addressing future trends in integrated silicon photonics
Charles Baudot (ST Micro)

Bringing EOCB’s to the market - what’s missing?
Felix Betschon (Variooptics)

Chip scale optical transceiver "optical I/O core" based on silicon photonics platform
Kazuhiko Kurata (PETRA)

High bandwidth density 3-D optical wiring realized with the Mosquito method
Takaaki Ishigure (Keio University, JP)

Round table discussion
Coffee Break

 

Session 4: What comes next?

Optical switching for scalable and programmable data center networks
Paraskevas Bakopoulos (National TU Athens, GR)

tbd
Huiyun Liu  (UCL, UK)

LiFi: Making Fiber Wireless
Mohamed Sufyan Islim (University of Edinburgh, UK) 

Round table discussion

Organized by
ITG - Informationstechnische Gesellschaft im VDE
VDE Verband der Elektrotechnik Elektronik Informationstechnik e.V.
Eurel Partner ECOC
ECOC 2016 Sponsor NOKIA
Gold Sponsor
Telekom Gold Sponsor ECOC 2016
ECOC 2016 Mediapartner Fibresystems
Mediapartner EPIC
ECOC 2016 Mediapartner bayernphotonics
ECOC 2016 Optical Connections
 
 
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