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EMLC 2018 

Tutorial 

EMLC 2018 Conference attendees have the possibility of taking part in a 

Tutorial at the MINATEC Conference Center on 
Monday, June 18th  2018,
14:00 to 17:00 

 

EMLC 2018 - Tutorial

 14:00 - 17:00   The EMLC 2018 Tutorial Class
     
 14:00  

Welcome
Uwe Behringer, UBC Microelectronics,
EMLC 2018 Conference Chair

Introduction of the first Tutorial Speaker
Izak Kapilevic, Applied Materials, USA

14:05 - 15:20

Inspection Challenges in the EUV Area
Aviram Tam, Applied Materials PDC, Israel

This Tutorial will cover the use cases for blank
inspection, pattern inspection, outgoing inspection,
and the possible solution for DUV mask inspection,
eBeam MI, Actinic blank inspection, on-wafer
qualification, and how those evolve in each of the
different scenarios for pellicle (no pellicle / detachable
/ 13.5nm only / 193nm friendly).
 

15:20 - 15:40 Coffee Break
     
 15:40 - 15:45   Introduction of the second Tutorial Speaker
Jo Finders, ASML Netherlands B.V.,
Veldhoven, The Netherlands
     
15:45 - 17:00 

Review of OPC/ RET/ SMO
Paul van Adrichem, ASML Netherlands B.V.,
Veldhoven, The Netherlands

This tutorial will provide an overview of advanced
Optical Proximity Correction, Resolution
Enhancement Technology as well as
Source-Mask-Optimization.

     
17:00 Get-Together and First Poster Session
Uwe Behringer, Chair of EMLC2018, welcomes
the participants and invites them to join the
Get-Together concurrently with the first
Poster Session.

  

17:05 - 18:00 First Part of Poster Presentations
Chair: Uwe Behringer, UBC Microelectronics,
Ammerbuch, Germany
Co-Chair: Rolf Seltmann, GLOBALFOUNDRIES,
Dresden, Germany
 
 

 

 Cooperating Partners

 
 
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