Preliminary Programme is now online!
Welcome to ESREF 2016
ESREF 2016, the 27th European Symposium on Reliability of Electron Devices, Failure Physics and Analysis will take place in Halle (Saale), Germany from September 19th to 22nd, 2016.
The conference continues to focus on recent developments and future directions in quality, robustness and reliability research of materials, components, integrated electronic circuits/systems and their nano-, micro-, power-, optoelectronics devices. ESREF provides the leading European forum for developing all aspects of reliability management and failure prevention for present and future electronics. ESREF 2016 will have a specific focus on reliability issues in automotive electronics.
ESREF Best Paper Awards 2015
- Taizhi Liu, Chang-Chih Chen, Soonyoung Cha and Linda Milor from Georgia Institute of Technology (USA) for the paper “System-level process-voltage-temperature variation-aware reliability simulator using an unified novel gate-delay model for BTI, HCI and GOBD” to be presented at IRPS 2016
- Davide Bisi et al from the University of Padova (Italy) for the paper “Effects of buffer compensation strategies on the electrical performance and RF reliability of AlGaN/GaN HEMTs” to be presented at IPFA 2016
- Peter Jacob from EMPA (Switzerland) for the paper “Unusual defects generated by wafer sawing: an update, including pick & place processing” to be presented at ISTFA 2016
ESREF 2015 Best Poster Award
- Kevin Melendez et al from CNES (France) for the paper “A way to implement the electro-optical technique to inertial MEMS”
A word from the General Chair
With regard to current technology developments and market trends in the automotive industries, it is very impressive to note how fast electronics became one of the most decisive factors for todays and future automotive applications. New trends like assisted driving and connected cars, electric vehicles, or progress in motor and safety managements are highly dependent on increasingly more complex semiconductor based systems. In turn, these new application fields are significantly affecting the technology roadmaps of the electronics industry. And there is no doubt- these thrilling developments will also pose many new and very challenging demands specifically on electronics robustness and reliability.
Thus, while ESREF 2016 will continue in considering the full spectrum of reliability topics in electronics, it will additionally address the field of automotive electronics reliability as its special topic. It is a great pleasure to invite you to meet the experts in electronics reliability and failure analysis at ESREF 2016 in Halle (Saale)!
Fraunhofer Institute for Microstructure of Materials and Systems (IWMS)
Center for Applied Microstructure Diagnostics (CAM)