Welcome to ESREF 2016
ESREF 2016, the 27th European Symposium on Reliability of Electron Devices, Failure Physics and Analysis will take place in Halle (Saale), Germany from September 19th to 22nd, 2016.
The conference continues to focus on recent developments and future directions in quality, robustness and reliability research of materials, components, integrated electronic circuits/systems and their nano-, micro-, power-, optoelectronics devices. ESREF provides the leading European forum for developing all aspects of reliability management and failure prevention for present and future electronics. ESREF 2016 will have a specific focus on reliability issues in automotive electronics.
The ESREF Best Paper Award committee selected three different best papers for exchange with IPRS, IPFA and ISTFA 2017, and one best poster:
 Andreas Martin |
IRPS 2017 Christian Schlünder, Fabian Proebster, Andreas Martin, Wolfgang Gustin and Hans Reisinger "Degradation and Recovery of variability due to BTI" |
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 Frank Altmann and Mikael Broas |
IPFA 2017 Mikael Broas, Andreas Graff, Michel Simon-Najasek, David Poppitz, Frank Altmann, Helmut Jung and Hervé Blanck "Correlation of gate leakage and local strain distribution in GaN/AlGaN HEMT structures" |
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 Fulvio Infante |
ISTFA 2017 Roberta Pilia, Guillaume Bascuil, Fulvio Infante, Kevin Sancez and Giovanna Mura "Single Event Transient Acquisition And Mapping For Space Device Characterization" |
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Best Poster
Etienne Auvray, Paul Armagnat, Morgan Cason, Emanuele Villa, Michael Bruegel and Maheshwaran Jothi
"Evolution of navigation and simulation tools in failure analysis"
Student Session Winners
 Dongseok Shin |
1. Dongseok Shin, Yonsei University "Device reliability of single photon avalanche diodes" |
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 Govindo Joannesha Syaranamual |
2. Govindo Joannesha Syaranamual, Nanyang Technologial University "Reliability of AlGaN/GaN High Electron Mobility Transistors (HEMTs) on Si Substrate" |
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 Glenn Ross |
3.Glenn Ross, Aalto University "Impurities in electroplated Cu and void formation in Cu-Sn micro-connects" |