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Panel Discussion 

ESREF 2016 


Panel Discussion:

“Reliability – getting the key factor for electronics in Europe today?”
Wednesday, September 21, from 11:50 to 13:50. in Room Fraunhofer

For the field of electronics, there is no doubt that reliability and defect avoidance aspects have recently very much gained in practical significance, and will be even more important in future. This trend is only to some extent due to further IC shrinking with only four competitors left for the race towards the 7 nm technology node. In contrast, the major part of the European semiconductor industry is working on topics like smart systems and heterogeneous systems integration, on application of wide bandgap materials, and on providing superior components for market segments like automotive, industry, energy and power, and the IoT.

Without any doubt, one of the most important drivers for research in reliability and quality assurance comes from new automotive electronics applications. In view of the recent developments towards electrical powertrains and in particular, advanced driver assistance systems on the way to autonomous driving, current electronic system developments have to balance a recently highly accelerated innovation rate on the one hand, and very high demands on quality and reliability on the other. The current debate around safety and reliability issues of automated cars gives evidence to this fact. This will have significant consequences for future research in electronics reliability and the required ecosystem.

Will a high reliability, superior quality and proven robustness continue to be a strength and asset of the European industry?
Are quality, reliability and robustness factors we need to pay even more attention to, and what do we have to do to prepare for the developments and demands coming up in the future? Within this context, the panel involving experts from car and electronics industry, from academia and from the ECSEL joint undertaking will discuss topics like:

  • the asset of superior reliability and robustness for European electronics
  • resulting future demands on supply chain and ecosystem
  • the related demands on scientific research and developments
  • needs in industry-academy cooperation
  • future governmental/European strategies for research and funding
  • consequences for university education



Berthold Hellenthal, AUDI AG (DE)
Sabine Herlitschka, Infineon Technologies Austria AG (AT)
Mervi Paulasto-Kröckel, Aalto University (FIN)
Yves Gigase, ECSEL Joint Undertaking
Klaus-Juergen Wolter, Georgia Tech Atlanta, 3D Systems Packaging Research Center (US)


VDE Konferenz Service
Jasmin Kayadelen
Stresemannallee 15
60596 Frankfurt
Telefon: 069 6308-275
Telefax: 069 6308-144
Fraunhofer IWMS
J.P. Kummer, Silver Sponsor ESREF 2016
Carl Zeiss Microscopy GmbH, Silver Sponsor of ESREF 2016
FEI, Silver Sponsor of ESREF 2016
Digit Concept, Wifi Sponsor for ESREF 2016
Orsay Pysics, Coffe Break Sponsor of EFUG Session at ESREF 2016
City of Halle, Sponsor of ESREF 2016
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