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Committees 

ESREF 2016 

27th EUROPEAN SYMPOSIUM ON RELIABILITY OF ELECTRON DEVICES,
FAILURE PHYSICS AND ANALYSIS

Following the committee members of ESREF 2016

 

ORGANIZATION COMMITTEE

General Chair:
M. Petzold, Fraunhofer IMWS-CAM (GER)

Conference Vice-Chairs:
M. Paulasto-Kröckel, Aalto University (FI)
E. Wolfgang, ECPE (GER)

Advisory board:
P. Perdu, CNES (FRA)
M. Bafleur, LAAS (FRA)
I. de Wolf, IMEC (BE)
W. Kanert, Infineon AG (GER)
B. Hellenthal, AUDI AG (GER)
E. Suhir, Portland State University (USA)

Technical Program Chairs:
F. Altmann, IMWS-CAM (GER)
E. Langer, Globalfoundries (GER)

Tutorial Chair:
P. Jacob, EMPA, (CH)

Exhibition Chair:
F. Infante, Intraspec Technologies (FR)

Publicity Chair:
J. Touzel, Infineon AG (GER)
 
Best Paper Chair:
N. Labat, IMS, University of Bordeaux (F)

Finance Chair:
V. Schanz, Information Technology Society, ITG, within VDE (GER)

Conference Organization Support:
C. Groß, VDE Conference Services (GER)
J. Kayadelen, VDE Conference Services (GER)

Local organization:
K. Stock, Fraunhofer IMWS-CAM (GER)

TECHNICAL PROGRAMME COMMITTEE

Session A
Quality and Reliability Assessment - Techniques and Methods for Devices and Systems
N. D. Stojadinovic, University of Nis (Serbia)
W. Kanert, Infineon AG (GER)

Session B
Semiconductor Reliability and Failure Mechanisms
M. Bafleur, LAAS (FRA)
O. Aubel, Globalfoundries (GER)

Session C
Reliability and Failure Mechanisms in Packaging and Assembly
H. Fremont, IMS, University of Bordeaux (FRA)
R. Rongen, NXP (NL)


Session D
Progress in Failure Analysis Methods
I. De Wolf, IMEC (BE)
W. Mack, Infineon AG (GER)

Session E
Power Devices Reliability
M. Ciappa, ETH Zurich (CH)
R. Bayerer, Infineon AG (GER)

Session F
Reliability and Failure Mechanisms of Wide Bandgap Devices
H-J. Würfl, FBH (GER)
S. Delage, III-V Lab, (FRA)

Session G
Reliability and Failure Mechanisms of special photonics and LED Devices
G. Mura, University of Cagliari (IT)
H. Brunner, Osram Licht AG (GER)

Session H
Reliability and Failure Mechanisms of MEMS and sensor systems
M. Paulasto-Kröckel, Aalto University (FI)
U. Hansen, Robert Bosch GmbH (GER)

Session I
Reliability of automotive electronics from a Systems perspective (CAM-EUFANET Industry Workshop)
S. Klengel, Fraunhofer IMWS-CAM (GER)
W. Wondrak, Daimler AG (GER)

Fraunhofer IWMS
J.P. Kummer, Silver Sponsor ESREF 2016
Carl Zeiss Microscopy GmbH, Silver Sponsor of ESREF 2016
FEI, Silver Sponsor of ESREF 2016
Digit Concept, Wifi Sponsor for ESREF 2016
Orsay Pysics, Coffe Break Sponsor of EFUG Session at ESREF 2016
City of Halle, Sponsor of ESREF 2016
 
 
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