EXCHANGE PAPERS coming to ESREF 2014
Best Paper at the IEEE International Reliability Physics Symposium (IRPS) 2014
Electromigration Failure of Circuit – Like Interconnects:
Short Length Failure Time Distributions with Active Sinks and Reservoirs
Tony Oates and Ming-Hsien Lin
TSMC Ltd., Hsinchu, Taiwan
Best Paper related to Reliability at the IEEE International Symposium
on the Physical and Failure Analysis of Integrated Circuits (IPFA) 2014
Study of (correlated) Trap Sites in SILC, BTI and RTN in SiON and HKMG Devices
Erik Bury1,2, Robin Degraeve1, Moonju Cho1, Ben Kaczer1, Wolfgang Goes3,
Tibor Grasser3, Naoto Horiguchi1, Guido Groeseneken1,2
1 IMEC, Belgium; 2 KU Leuven, Belgium; 3 TU Wien, Austria
Outstanding Paper at the International Symposium for
Testing and Failure Analysis (ISTFA) 2013
Laser Voltage Imaging and Its Derivatives, Efficient Techniques
to Address Defect On 28nm Technology
Thierry Parrassin1, Guillaume Celi1, Antoine Reverdy2, Sylvain Dudit1, Michel Vallet1, Philippe Perdu3, Dean Lewis4
1 STMicroelectronics, Crolles, France; 2 Sector Technologies, Gieres, France;
3 Centre National d'Etudes Spatiales (CNES), Toulouse, France; 4 IMS laboratory, University of Bordeaux, Talence, France