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Workshops 

ESREF 2014 

25th EUROPEAN SYMPOSIUM ON RELIABILITY OF ELECTRON DEVICES,
FAILURE PHYSICS AND ANALYSIS

 

 

 

8th European FIB Users Group
Meeting (EFUG2014)

 

Tue-B-13:10-14:50-Workshop

------ Premliminary Programme ------

Problems and solutions when using FIB to prep
nanostructures for TEM
Filip Lenrick, Lund University, Sweden

TEM Sample Preparation by Xe Plasma FIB
O. Salord 1, A. Delobbe 1, T. Hrncir 2, A. David 3,
P. Sudraud 1, F. Lopour 2,
1 Orsay Physics, 2 TESCAN Brno, 3 Biophy Research

Maximizing Circuit Edit Efficiency by Adding
Nanoprobing Capability
Andreas Rummel, Andrew J. Smith, Stephan Kleindiek
Kleindiek, Germany

Extending Dualbeam Applications with the Helios
PFIB
David Donnet, FEI Company

Poster:

Low temperature FIB cross section: application
to indium micro bumps
L. Dantas de Morais, S. Chevalliez, S. Mouleres,
SOFRADIR

 

 

 

 

 

15th EUFANET Workshop

 

Wed-A-15:50-17:30-Workshop

------ Copper sample prep challenges and solutions ------


You are cordially invited to attend and actively participate
in this workshop and enjoy technical debates on
copper sample preparation challenges and solutions.
The preliminary agenda is:

Overview of copper challenges, an intro: Copper in state-of-the-art Microelectronic Products and Systems: new Challenges for FA
Siegfried Goerlich, Infineon, Germany

Chip access: Comparative Study on Decapsulation for Copper and Silver Wire-Bonded evices
Michael Obein, Digit Concept, France

Cu as part of the defect: Copper dendrites growth in LLT (Lead Lock Tape) embedded in QFP package: physical identification and characterization
Giuseppe Giuga, STM, Italy

Preparation techniques for preservation of grain structure: A comparison of preparation techniques for Cu filled TSV characterization
Frank Altmann, IWMH, Halle, Germany

Discussion

Wrap up

 

 

 

 

Annual ESREF-ECPE Power
Devices Workshop


Wed-B-15:50-17:30-Workshop

------ Reliability of Passive Devices ------


Experts in this field will make brief statements and
then the audience and the experts will discuss issues
of interest, as it was done at ESREF conferences in
the 22 previous years.


Introduction
Moderator: Eckhard Wolfgang, ECPE, Germany

Modeling of failures
Moderator: Mauro Ciappa, ETH Zurich/CH

Embedded Capacitors
Helene Fremont, IMS-Bordeaux, France

Film Capacitors
Patrick McCluskey, CALCE/USA

Corona Discharge in Film Capacitors with AC Load
Peter Jacob, EMPA, Switzerland

 

3D & CPI & Harsh Environment Workshop


Thu-C-13:30-14:10-Workshop 

------ Premliminary Programme ------

 
Intro
Ingrid DeWolf, IMEC, Belgium

Can we live with stress in 3D/CPI?
Speaker: Ingrid DeWolf, IMEC, Belgium

Do we need dedicated (new) reliability tests (and
detection methods) for 3D/CPI related failure
mechanisms?
Speaker: Didier Bloch, LAAS, France

Are new failure analysis techniques such as magnetic
imaging, GHz SAM, lock-in thermography
sufficient to tackle all FA issues in 3D/CPI. What
do we need more?
Speaker: Frank Altmann, Fraunhofer IWM Halle,
Germany

 
 
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