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EMLC 2018 

Invited Speakers 

May we present you the Invited Speakers of the EMCL 2018 Conference


[Would you please click at the titles in order to open the Abstracts] 


Tuesday, June 19th, 2018

 10:00 Best Poster BACUS 2017
Transparent and conductive backside coating of
EUV Lithography Masks for ultrashort pulse Laser Correction       

R. A. Maniyaraa, D. S. Ghosha, V. Pruneria,b
a) ICFO - Institut de Ciències Fotòniques,
The Barcelona Institute of Science and Technology, Barcelona, Spain
b) ICREA - Institució Catalana de Recerca I Estudis Avançats, Barcelona, Spain
 11:20 Multi-Beam Mask Writer – Enabling Tool for EUV Lithography
P. Mayrhofer, C. Klein, E. Platzgummer,
IMS Nanofabrication GmbH, Vienna, Austria


 11:45 Multi-beam mask writer MBM-1000 for advanced mask making
H. Matsumoto, H. Yamashita, H. Matsumoto, N. Nakayamada,
NuFlare Technology, Inc., Yokohama, Kanagawa, Japan
 13:20 Multi-Trigger Resist for Electron Beam and Extreme Ultraviolet Lithography
C. Popescu1,2, A. McClelland3, G. Dawson3, J. Roth4, A.P.G. Robinson2,3
1) Nanoscale Physics, University of Birmingham, UK
2) School of Chemical Engineering, University of Birmingham, UK
3) Irresistible Materials Ltd., Birmingham, UK
4) Nano-C., Westwood, MA, USA


 13:45 Photonic superlattice multilayers for EUV lithography infrastructure
F. Kuchar, R. Meisels, Montanuniversität Leoben, Austria


 14:10 EUV Pellicle Update   
J.-W. van der Horst, D. Brouns, P. Broman, R. Lafarre, T. Modderman, G. Salmaso, ASML Netherlands B.V., Veldhoven, Netherlands


 14:55 Reticle CDU improvement by Zeiss CDC and the impact on real circuit pattern       
R. Seltmann1, T. Thamm1, B. Geh4, M. D. Kaufmann2, A. Bitensky3,
A. N. Samy1, S. Maelzer1, M. Sczyrba5
1) GLOBALFOUNDRIES Dresden, Germany
2) Carl Zeiss SMT GmbH, Oberkochen, Germany
3) Carl Zeiss SMS, D.N. Misgav, Israel
4) Carl Zeiss SMT, Chandler, Arizona, USA
5) Advanced Mask Technology Center GmbH & Co. KG, Dresden, Germany
 15:45 Performance Validation of Mapper’s FLX-1200
J. Pradellesa, Y. Blancquaerta, S. Landisa, L. Paina, G. Rademakera, I. Servina,G. de Boerb, P. Brandtb, M. Dansbergb, R. Jagerb, J. Peijsterb, E. Slotb, S. Steenbrinkb, M. Wielandb
a) CEA-LETI, Grenoble, France
b) MAPPER Lithography, Delft, The Netherlands


16:30 Wafer-Level UV-Nanoimprint Lithography for high resolution and complex 3D Structures
T. Glinsner1, M. Eibelhuber1, G. Berger1, M. Chouiki1, C. Lenk2,
M. Hofmann2, S. Lenk2, T. Ivanov2, I. W. Rangelow2, A. Ahmad3,
A. Reum3, M. Holz3
1) EV Group, St. Florian am Inn, Austria
2) TU Ilmenau, Germany
3) Nanoanalytik GmbH, lmenau, Germany


17:15 Silicon nanowires patterning using UV-assisted graphoepitaxy DSA lithography
M. Argouda, G. Claveaua, P. Pimenta Barrosa, Z. Chalupaa, G. Chamiot-Maitrala, C. Navarrob, C. Nicoletb, I. Cayrefourcqc, R. Tirona
a) CEA-LETI, Minatec Campus, Grenoble, France
b) ARKEMA FRANCE, Lacq, France
c) ARKEMA FRANCE, Colombes, France


Wednesday, June 20th, 2018

 09:35   Lithography technology and trends for More than Moore devices – Advanced Packaging & MEMS devices
A. Pizzagalli, Yole Développement, Lyon, France
 10:00   Best Paper of Photomask Japan 2018
Development of closed-type EUV pellicle

Y. Ono, K. Kohmura, A. Okubo, D. Taneichi, H. Ishikawa, T. Biyajima
Mitsui Chemicals Inc., Tokyo, Japan
 16:45   Automatic Defect Classification of SEM images using Deep

L. Bidault, D. Mastroeni, STMicroelectronics Rousset, France





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