| Session1 |
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| 10:00 |
Best Poster BACUS 2017
Transparent and conductive backside coating of
EUV Lithography Masks for ultrashort pulse Laser Correction
R. A. Maniyaraa, D. S. Ghosha, V. Pruneria,b
a) ICFO - Institut de Ciències Fotòniques,
The Barcelona Institute of Science and Technology, Barcelona, Spain
b) ICREA - Institució Catalana de Recerca I Estudis Avançats, Barcelona, Spain |
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| Session2 |
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| 11:20 |
Multi-Beam Mask Writer – Enabling Tool for EUV Lithography
P. Mayrhofer, C. Klein, E. Platzgummer,
IMS Nanofabrication GmbH, Vienna, Austria |
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| 11:45 |
Multi-beam mask writer MBM-1000 for advanced mask making
H. Matsumoto, H. Yamashita, H. Matsumoto, N. Nakayamada,
NuFlare Technology, Inc., Yokohama, Kanagawa, Japan |
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| Session3 |
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| 13:20 |
Multi-Trigger Resist for Electron Beam and Extreme Ultraviolet Lithography
C. Popescu1,2, A. McClelland3, G. Dawson3, J. Roth4, A.P.G. Robinson2,3
1) Nanoscale Physics, University of Birmingham, UK
2) School of Chemical Engineering, University of Birmingham, UK
3) Irresistible Materials Ltd., Birmingham, UK
4) Nano-C., Westwood, MA, USA
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| 13:45 |
Photonic superlattice multilayers for EUV lithography infrastructure
F. Kuchar, R. Meisels, Montanuniversität Leoben, Austria |
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| 14:10 |
EUV Pellicle Update
J.-W. van der Horst, D. Brouns, P. Broman, R. Lafarre, T. Modderman, G. Salmaso, ASML Netherlands B.V., Veldhoven, Netherlands |
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| 14:55 |
Reticle CDU improvement by Zeiss CDC and the impact on real circuit pattern
R. Seltmann1, T. Thamm1, B. Geh4, M. D. Kaufmann2, A. Bitensky3,
A. N. Samy1, S. Maelzer1, M. Sczyrba5
1) GLOBALFOUNDRIES Dresden, Germany
2) Carl Zeiss SMT GmbH, Oberkochen, Germany
3) Carl Zeiss SMS, D.N. Misgav, Israel
4) Carl Zeiss SMT, Chandler, Arizona, USA
5) Advanced Mask Technology Center GmbH & Co. KG, Dresden, Germany |
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| Session4 |
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| 15:45 |
Performance Validation of Mapper’s FLX-1200
J. Pradellesa, Y. Blancquaerta, S. Landisa, L. Paina, G. Rademakera, I. Servina,G. de Boerb, P. Brandtb, M. Dansbergb, R. Jagerb, J. Peijsterb, E. Slotb, S. Steenbrinkb, M. Wielandb
a) CEA-LETI, Grenoble, France
b) MAPPER Lithography, Delft, The Netherlands |
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| 16:30 |
Wafer-Level UV-Nanoimprint Lithography for high resolution and complex 3D Structures
T. Glinsner1, M. Eibelhuber1, G. Berger1, M. Chouiki1, C. Lenk2,
M. Hofmann2, S. Lenk2, T. Ivanov2, I. W. Rangelow2, A. Ahmad3,
A. Reum3, M. Holz3
1) EV Group, St. Florian am Inn, Austria
2) TU Ilmenau, Germany
3) Nanoanalytik GmbH, lmenau, Germany |
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| 17:15 |
Silicon nanowires patterning using UV-assisted graphoepitaxy DSA lithography
M. Argouda, G. Claveaua, P. Pimenta Barrosa, Z. Chalupaa, G. Chamiot-Maitrala, C. Navarrob, C. Nicoletb, I. Cayrefourcqc, R. Tirona
a) CEA-LETI, Minatec Campus, Grenoble, France
b) ARKEMA FRANCE, Lacq, France
c) ARKEMA FRANCE, Colombes, France |