ESREF 2014, the 25th anniversary of the European Symposium on Reliability of Electron Devices, Failure Physics and Analysis will take place in Berlin (Germany) from September 29th to October 2nd, 2014.
This international symposium continues to focus on recent developments and future directions in quality and reliability management of materials, devices and circuits for micro, nano, and optoelectronics. It provides a European forum for developing all aspects of reliability management and innovative analysis techniques for present and
future electronic applications.
A word from the general chair
To characterize the dynamic potential of Berlin, I personally like to
use the term “city of the unexpected”. Take on the surprise which Berlin offers its people, be it visitors or locals.
And we, the organizers of ESREF 2014, take our part by making the conference itself an unexpected one – unexpectedly productive with 6 topical tracks, a special merge of tutorials, sessions and workshops. While focussing on rapidly growing topics like organic devices, 3D packaging and wide bandgap (power) devices, the conference is solidly grounded on industry oriented fundaments of microelectronics, power devices and respective failure analysis.
For the first time, the European FIB User Group, EFUG, is integrated as one large topical track in the conference program.
Let the different spices served at ESREF2014 inspire you, and expand your Berlin experience with our social event arranged in the Berlin club scene area “Kulturbrauerei”.
We are eager to welcome you!
Chair of ESREF 2014
Head of the department of Semiconductor Devices, TU Berlin